QST108KT6 STMicroelectronics, QST108KT6 Datasheet - Page 45

• Manufacturer Part Number: QST108KT6
• Manufacturer: STMicroelectronics

Specifications of QST108KT6

• Lead Free Status / Rohs Status: Compliant

QST108
7.1
Soldering information
In accordance with the RoHS European directive, all STMicroelectronics packages have
been converted to lead-free technology, named ECOPACK™.
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Backward and forward compatibility
The main difference between Pb and Pb-free soldering process is the temperature range.
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Table 37.
1. Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is
SDIP & PDIP
DFN8
TQFP and SO
compatible with their Lead-free soldering process.
Package
ECOPACK™ packages are qualified according to the JEDEC STD-020C compliant
soldering profile.
Detailed information on the STMicroelectronics ECOPACK™ transition program is
available on www.st.com/stonline/leadfree/, with specific technical Application notes
covering the main technical aspects related to lead-free conversion (AN2033, AN2034,
AN2035, and AN2036).
ECOPACK™ LQFP, SDIP, SO and DFN8 packages are fully compatible with Lead (Pb)
containing soldering process (see application note AN2034).
LQFP, SDIP and SO Pb-packages are compatible with Lead-free soldering process,
nevertheless it's the customer's duty to verify that the Pb-packages maximum
temperature (mentioned on the Inner box label) is compatible with their Lead-free
soldering temperature.
Soldering Compatibility (wave and reflow soldering process
Sn (pure Tin)
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
Plating material devices
Pb solder paste Pb-free solder paste
Yes
Yes
Yes
Package mechanical data
Yes
Yes
Yes
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