LTC2351HUH-14#PBF Linear Technology, LTC2351HUH-14#PBF Datasheet - Page 19

• Manufacturer Part Number: LTC2351HUH-14#PBF
• Description: IC ADC 14BIT 1.5MSPS 32-QFN
• Manufacturer: Linear Technology

Specifications of LTC2351HUH-14#PBF

• Number Of Bits: 14
• Sampling Rate (per Second): 1.5M
• Data Interface: Serial, SPI™
• Number Of Converters: 1
• Power Dissipation (max): 16.5mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-WFQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTION
5.50 ±0.05
4.10 ±0.05
(4 SIDES)
3.50 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
3.45 ± 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 ± 0.10
(4 SIDES)
3.45 ± 0.05
0.50 BSC
0.25 ± 0.05
32-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-169)
0.70 ±0.05
PACKAGE OUTLINE
UH Package
0.75 ± 0.05
(4-SIDES)
0.00 – 0.05
3.50 REF
0.200 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
3.45 ± 0.10
TYP
3.45 ± 0.10
31
0.50 BSC
0.25 ± 0.05
LTC2351-14
32
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
(UH32) QFN 0406 REV D
1
2
0.40 ± 0.10
19
235114fb