LTC2290IUP#PBF Linear Technology, LTC2290IUP#PBF Datasheet - Page 23

• Manufacturer Part Number: LTC2290IUP#PBF
• Description: IC ADC DUAL 12BIT 10MSPS 64QFN
• Manufacturer: Linear Technology

Specifications of LTC2290IUP#PBF

• Number Of Bits: 12
• Sampling Rate (per Second): 10M
• Data Interface: Parallel
• Number Of Converters: 2
• Power Dissipation (max): 138mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-WFQFN, Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTIO
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 5)
9 .00 ± 0.10
(4 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
0.25 ±0.05
U
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
0.70 ±0.05
7.15 ±0.05
(4 SIDES)
PACKAGE OUTLINE
0.75 ± 0.05
UP Package
8.10 ±0.05 9.50 ±0.05
7.15 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
CHAMFER
PIN 1
0.50 BSC
0.25 ± 0.05
LTC2290
63
64
(UP64) QFN 1003
23
0.40 ± 0.10
1
2
2290fa