SI5325C-B-GM Silicon Laboratories Inc, SI5325C-B-GM Datasheet - Page 12

• Manufacturer Part Number: SI5325C-B-GM
• Description: IC UP-PROG CLK MULTIPLIER 36QFN
• Manufacturer: Silicon Laboratories Inc
• Type: Clock Multiplierr

Specifications of SI5325C-B-GM

• Number Of Circuits: 1
• Package / Case: 36-QFN
• Pll: Yes
• Input: Clock
• Output: CML, CMOS, LVDS, LVPECL
• Ratio - Input:output: 2:2
• Differential - Input:output: Yes/Yes
• Frequency - Max: 346MHz
• Divider/multiplier: Yes/Yes
• Voltage - Supply: 1.62 V ~ 3.63 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Frequency-max: 346MHz
• Maximum Input Frequency: 710 MHz
• Minimum Input Frequency: 10 MHz
• Output Frequency Range: 10 MHz to 1417 MHz
• Supply Voltage (max): 3.63 V
• Supply Voltage (min): 1.62 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 1.8 V, 2.5 V, 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Si5325
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Notes (General):
Notes (Solder Mask Design):
Notes (Stencil Design):
Notes (Card Assembly):
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
used to assure good solder paste release.
center ground pad.
for Small Body Components.
Dimension
GD
GE
E2
D2
ZE
ZD
D
E
X
Y
e
Table 5. PCB Land Pattern Dimensions
Preliminary Rev. 0.26
4.00
4.00
4.53
4.53
MIN
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—
—
0.50 BSC.
5.42 REF.
5.42 REF.
0.89 REF.
MAX
4.20
4.20
0.28
6.31
6.31
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—