MB88151APNF-G-100-JNE1 Fujitsu Semiconductor America Inc, MB88151APNF-G-100-JNE1 Datasheet - Page 21

• Manufacturer Part Number: MB88151APNF-G-100-JNE1
• Description: IC SSCG EMI RED 8-SOIC
• Manufacturer: Fujitsu Semiconductor America Inc
• Type: Fanout Distribution, Spread Spectrum Clock Generatorr

Specifications of MB88151APNF-G-100-JNE1

• Pll: Yes
• Input: CMOS
• Output: CMOS
• Number Of Circuits: 1
• Ratio - Input:output: 1:2
• Differential - Input:output: No/No
• Frequency - Max: 33.4MHz
• Divider/multiplier: No/Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC
• Frequency-max: 33.4MHz
• For Use With: 865-1032 - BOARD EVALUATION FOR MB88151
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 865-1039

■ PACKAGE DIMENSION
Please confirm the latest Package dimension by following URL.
http://edevice.fujitsu.com/package/en-search/
DS04-29127-2E
©2002-2008 FUJITSU MICROELECTRONICS LIMITED F08004S-c-4-8
C
2002 FUJITSU LIMITED F08004S-c-4-7
8-pin plastic SOP
1.27(.050)
(FPT-8P-M02)
1
8
*
1
5.05
+0.25
–0.20
8-pin plastic SOP
(FPT-8P-M02)
.199
0.10(.004)
0.10(.004)
+.010
–.008
5
4
(.017±.003)
0.44±0.08
*
2
(.154±.012) (.236±.016)
3.90±0.30
6.00±0.40
0.13(.005)
0.40(.016)
M
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
45 ˚
Mounting height
Sealing method
Package width ×
package length
Lead shape
Lead pitch
Weight
"A"
0.22
.009
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
+0.03
–0.07
+.001
–.003
Details of "A" part
(.020±.008)
(.024±.006)
0.50±0.20
0.60±0.15
(.061±.008)
1.55±0.20
0~8 ˚
0.25(.010)
3.9 × 5.05 mm
1.75 mm MAX
(Mounting height)
Plastic mold
MB88151A
1.27 mm
Gullwing
0.06 g
(.006±.004)
(Stand off)
0.15±0.10
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