ICS85454AK-01LF IDT, Integrated Device Technology Inc, ICS85454AK-01LF Datasheet - Page 11

• Manufacturer Part Number: ICS85454AK-01LF
• Description: IC MUX DUAL 2:1/1:2 16-VFQFPN
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: HiPerClockS™r
• Type: Fanout Buffer (Distribution), Multiplexerr

Specifications of ICS85454AK-01LF

• Number Of Circuits: 2
• Ratio - Input:output: 2:1, 1:2
• Differential - Input:output: No/No
• Input: CML, LVDS, LVPECL
• Output: LVDS
• Frequency - Max: 2.5GHz
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN
• Frequency-max: 2.5GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 85454AK-01LF

T
This section provides information on power dissipation and junction temperature for the ICS85454-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS85454-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
no air flow of and a multi-layer board, the appropriate value is 51.5°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air
flow, and the type of board (single layer or multi-layer).
85454AK-01
ABLE
·
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.236W * 51.5°C/W = 97.2°C. This is well below the limit of 125°C.
JA
A
Multi-Layer PCB, JEDEC Standard Test Boards
6. T
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
Power_
HERMAL
Integrated
Circuit
Systems, Inc.
MAX
R
= V
ESISTANCE
DD_MAX
* I
DD_MAX
JA
FOR
= 2.625V * 90mA = 236.3mW
JA
16-P
vs. 0 Air Flow (Linear Feet per Minute)
P
www.icst.com/products/hiperclocks.html
DD
JA
OWER
= 2.5V + 5% = 2.625V, which gives worst case results.
* Pd_total + T
IN
VFQFN, F
C
ONSIDERATIONS
A
ORCED
11
51.5°C/W
C
ONVECTION
0
D
IFFERENTIAL
TM
devices is 125°C.
-
TO
-LVDS M
ICS85454-01
JA
must be used. Assuming
D
REV. B OCTOBER 28, 2008
UAL
ULTIPLEXER
2:1/1:2