ML610Q408-NNNTBZ03A7 Rohm Semiconductor, ML610Q408-NNNTBZ03A7 Datasheet - Page 14
ML610Q408-NNNTBZ03A7
Manufacturer Part Number
ML610Q408-NNNTBZ03A7
Description
MCU 8BIT 16K FLASH 8CH 100-TQFP
Manufacturer
Rohm Semiconductor
Series
-r
Datasheets
1.ML610Q482P-NNNTB03A7.pdf
(20 pages)
2.ML610Q407P-NNNTB03A7.pdf
(33 pages)
3.ML610Q407P-NNNTB03A7.pdf
(391 pages)
Specifications of ML610Q408-NNNTBZ03A7
Core Processor
nX-U8/100
Core Size
8-Bit
Speed
2MHz
Connectivity
SSP, UART/USART
Peripherals
LCD, Melody Driver, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
16KB (8K x 16)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.25 V ~ 3.6 V
Data Converters
A/D 2x16b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 70°C
Package / Case
100-TFQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ML610Q408-NNNTBZ03A7
Manufacturer:
Rohm Semiconductor
Quantity:
10 000
- ML610Q482P-NNNTB03A7 PDF datasheet
- ML610Q407P-NNNTB03A7 PDF datasheet #2
- ML610Q407P-NNNTB03A7 PDF datasheet #3
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- Download datasheet (2Mb)
ML610Q407/ML610Q408/ML610Q409 User’s Manual
Contents
Chapter 25
25. M ask ROM Version Emulation Function ....................................................................................................................... 25-1
Appendixes
Appendix A
Appendix B
Appendix C
Appendix D
Appendix E
25.1 Overview .................................................................................................................................................................. 25-1
25.2 Method of Connecting to On-Chip Debug Emulator................................................................................................ 25-1
25.3 Notice for the software Program Development ........................................................................................................ 25-2
25.4 The Detail Specification of Mask ROM Version Mode ......................................................................................... 25-11
25.3.1 Notice for the Mask ROM Version Mode setting data ........................................................................................ 25-2
25.3.2 Notice for the Mask ROM Version Mode Memory Size ................................................................................... 25-10
Registers .......................................................................................................................................................... A-1
Package Dimensions........................................................................................................................................ B-1
Electrical Characteristics ................................................................................................................................. C-1
Application Circuit Example........................................................................................................................... D-1
Check List.........................................................................................................................................................E-1
Contents –9
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