PPC440EP-3JC533C Applied Micro Circuits Corporation, PPC440EP-3JC533C Datasheet - Page 66

• Manufacturer Part Number: PPC440EP-3JC533C
• Manufacturer: Applied Micro Circuits Corporation

Specifications of PPC440EP-3JC533C

• Family Name: 440EP
• Device Core: PowerPC
• Device Core Size: 16b
• Frequency (max): 533MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5/2.5V
• Operating Supply Voltage (max): 1.6/2.7V
• Operating Supply Voltage (min): 1.4/2.3V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 456
• Lead Free Status / RoHS Status: Compliant

Table 16. Package Thermal Specifications
Thermal resistance values for the E-PBGA and TE-PBGA package are as follows:
Thermal Management
The following heat sinks were used in the above thermal analysis:
ALPHA W35-15W (35mm x 35mm x15mm)
ALPHA LPD35-15B (35mm x 35mm x15mm)
The heat sinks are manufactured by:
Alpha Novatech, Inc. (www.alphanovatech.com)
473 Sapena Court, #12
Santa Clara, CA 95054
Phone: [phone]
Test Conditions
Clock timing and switching characteristics are specified in accordance with operating
conditions shown in the table “Recommended DC Operating Conditions.” AC
specifications are characterized with V
shown in the figure to the right.
66
Revision 1.29 – May 07, 2008
Junction-to-ambient thermal resistance
without heat sink
Junction-to-ambient thermal resistance
with heat sink
Junction-to-case thermal resistance
Junction-to-board thermal resistance
Notes:
1. Case temperature, T
2. T
3. T
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved with a JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
A
CMax
= T
Data Sheet
=
C
- P
T
JMax
Parameter
×θ
CA
- P
, where T
×θ
JC
C
, is measured at top center of case surface with device soldered to circuit board.
, where T
A
is ambient temperature and P is power consumption.
JMax
is maximum junction temperature (+125°C) and P is power consumption.
Symbol
DD
θ
θ
θ
θ
JA
JA
JC
JB
= 1.5V, T
Package
E-PBGA
E-PBGA
E-PBGA
E-PBGA
J
= +125 °C and a 50pF test load as
440EP – PPC440EP Embedded Processor
0 (0)
20.0
15.3
Resistance Value
ft/min (m/sec)
100 (0.51)
Airflow
18.7
11.9
14.3
8.3
200 (1.02)
17.9
10.5
Output
Pin
°C/W
°C/W
°C/W
°C/W
Unit
AMCC Proprietary
50pF
Notes