HSDL-3602-007 Lite-On Electronics, HSDL-3602-007 Datasheet - Page 15

Infrared Transceivers IR Transceiver 4.0Mb/s

HSDL-3602-007

Manufacturer Part Number
HSDL-3602-007
Description
Infrared Transceivers IR Transceiver 4.0Mb/s
Manufacturer
Lite-On Electronics
Type
TX/RXr
Series
-r
Datasheet

Specifications of HSDL-3602-007

Pulse Width
1.6/4us
Led Supply Voltage
-0.5 to 7V
Dimensions
12.2x4.9x4
Peak Wavelength
875/880nm
Angle Of Half Sensitivity
60/30°
Communication Distance
150
Fall Time
40/25ns
Rise Time
40/25ns
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Mounting
Surface Mount
Pin Count
10
Operating Temp Range
-20C to 70C
Operating Temperature Classification
Commercial
Data Rate
3.90625Mbps
Wavelength
875 nm, 880 nm
Continual Data Transmission
4 Mbit/s
Transmission Distance
1.5 m
Radiant Intensity
250 mW/sr
Half Intensity Angle Degrees
30 deg to 60 deg
Maximum Rise Time
40 ns, 25 ns
Maximum Fall Time
40 ns, 25 ns
Maximum Forward Current
165 mA
Operating Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 20 C
Idle Current, Typ @ 25° C
2.5mA
Link Range, Low Power
1m
Operating Temperature
-20°C ~ 70°C
Orientation
Side View
Shutdown
Yes
Size
12.2mm x 4.9mm x 4mm
Standards
IrPHY 1.4
Supply Voltage
2.7 V ~ 3.6 V
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSDL-3602-007
Manufacturer:
LITEON
Quantity:
163
Part Number:
HSDL-3602-007
Manufacturer:
AVAGO
Quantity:
1 000
Part Number:
HSDL-3602-007
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HSDL-3602-007
Quantity:
520
15
1.2. Adjacent Land Keep-out and Solder Mask Areas
Figure 3. HSDL-3602-007/-037 PCBA-Adjacent land keep-out and solder mask.
• Adjacent land keep-out is the maximum space oc-
• “h” is the minimum solder resist strip width required
• It is recommended that 2 fiducial cross be placed at
Note : Wet/Liquid Photo-Imagineable solder resist/mask
is recommended.
Dim.
h
j
k
l
cupied by the unit relative to the land pattern. There
should be no other SMD components within this
area.
to avoid solder bridging adjacent pads.
mid-length of the pads for unit alignment.
LAND
Tx LENS
h
mm
min. 0.2
13.4
4.7
3.2
j
Y
0.528
min. 0.008
inches
0.185
0.126
Rx LENS
SOLDER
MASK
k
l
• ADJACENT LAND KEEP-OUT IS THE
MAXIMUM SPACE OCCUPIED BY THE
UNIT RELATIVE TO THE LAND PATTERN.
THERE SHOULD BE NO OTHER SMD
COMPONENTS WITHIN THIS AREA.
• "h" IS THE MINIMUM SOLDER RESIST
STRIP WIDTH REQUIRED TO AVOID
SOLDER BRIDGING ADJACENT PADS.
• IT IS RECOMMENDED THAT 2 FIDUCIAL
CROSS BE PLACED AT MID-LENGTH OF
THE PADS FOR UNIT ALIGNMENT.
DIM.
h
k
j
l
MIN. 0.2
13.4
mm
4.7
3.2
MIN. 0.008
INCHES
0.528
0.185
0.126

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