HSDL-3021-021 Avago Technologies US Inc., HSDL-3021-021 Datasheet

Infrared Transceivers FIR + RC

HSDL-3021-021

Manufacturer Part Number
HSDL-3021-021
Description
Infrared Transceivers FIR + RC
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HSDL-3021-021

Wavelength
885 nm
Continual Data Transmission
4 Mbit/s
Transmission Distance
50 cm
Radiant Intensity
4 mW/sr
Half Intensity Angle Degrees
30 deg
Pulse Width
4 us, 1.6 us
Maximum Rise Time
40 ns, 600 ns
Maximum Fall Time
40 ns, 600 ns
Led Supply Voltage
0 V to 6.5 V
Operating Voltage
2.4 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 25 C
Dimensions
8 mm x 3 mm x 2.5 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

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Manufacturer
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Part Number:
HSDL-3021-021
Manufacturer:
Agilent
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AVAGO/安华高
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HSDL-3021-021/HSDL3021
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Agilent
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10 000
HSDL-3021
IrDA
Remote Control Infrared Transceiver
Data Sheet
Description
The HSDL-3021 is a new generation low profile high
speed enhanced infrared (IR) transceiver module
that provides the capability of (1) interface between
logic and IR signals for through-air, serial, half-
duplex IR data link, and (2) IR remote control
transmission for universal remote control
applications. The HSDL-3021 can be used for IrDA as
well as remote control application without the need
of any additional external components for
multiplexing.
The HSDL-3021 is fully compliant to IrDA® Physical
Layer specification version 1.4 low power from 9.6
kbit/s to 4.0 Mbit/s (FIR) and IEC825 Class 1 eye
safety standards.
The HSDL-3021 can be shut down completely to
achieve very low power consumption. In the shut-
down mode, the PIN diode will be inactive and thus
produce very little photocurrent even under very
bright ambient light. It is also designed to interface to
input/output logic circuits as low as 1.5 V. These
features are ideal for battery operated mobile devices
such as PDAs and mobile phones that require low
power consumption.
®
Data Compliant Low Power 4.0 Mbit/s with
Features
General Features
• Operating temperature from -25 C ~ 85 C
• V
• Miniature package
• Integrated remote control LED driver
• Input/output interface voltage of 1.5 V
• Integrated EMI shield
• LED stuck-high protection
• Designed to accommodate light loss with cosmetic windows
• IEC 825-Class 1 eye safe
• Interface to various super I/O and controller devices
• Lead free package
IrDA
• Fully compliant to IrDA 1.4 Physical Layer Low Power
• Complete shutdown for TxD_IrDA, RxD_IrDA and PIN diode
• Low power consumption
Remote Control Features
• Wide angle and high radiant intensity
• Spectrally suited to remote control function at 890 nm
• Typical link distance up to 8 meters (on-axis)
Applications
• Mobile data communication and universal remote control
– Critical parameters are guaranteed over temperature and
– Height: 2.5 mm
– Width: 8.0 mm
– Depth: 3.0 mm
Specifications from 9.6 kbit/s to 4.0 Mb/s
– Link distance up to 50 cm typically
– Low shutdown current
typically
– Mobile phones
– PDAs
– Webpads
CC
®
supply voltage
supply 2.4 to 3.6 volts
Features

Related parts for HSDL-3021-021

HSDL-3021-021 Summary of contents

Page 1

... Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver Data Sheet Description The HSDL-3021 is a new generation low profile high speed enhanced infrared (IR) transceiver module that provides the capability of (1) interface between logic and IR signals for through-air, serial, half- ...

Page 2

... CC LED DRIVER PULSE SHAPER Order Information Part Number Packaging Type HSDL-3021-021 Tape and Reel Marking Information The unit is marked with “HYWLL” on the shield Y = Year W = Work week LL = Lot information Package Quantity Front Option 2500 ...

Page 3

... CX2, CX4 4.7 F, 20%, Tantalum Note: 1. CX1, CX2, CX3 & CX4 must be placed within 0 HSDL-3021 to obtain optimum noise immunity. CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD ...

Page 4

Absolute Maximum Ratings For implementations where case to ambient thermal resistance is 50 C/W. Parameter Storage Temperature Operating Temperature LED Anode Voltage Supply Voltage Input Voltage: TXD, SD/Mode Input/Output Supply Voltage: RXD IR LED Current Pulse Amplitude RC LED Current ...

Page 5

Electrical and Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are with V 3.0 V ...

Page 6

Electrical and Optical Specifications (Cont’d.) Parameter IR LED Anode On-State Voltage (SIR Mode) IR LED Anode On-State Voltage (MIR/FIR Mode) Remote Control (RC) Transmitter RC Radiant Intensity RC Viewing Angle RC Peak Wavelength TxD_RC Logic Levels High Low TxD_RC Input ...

Page 7

Timing Waveforms 90% 50% 10 Waveform 1. RXD output waveform t LED ON 90% 50% 10% LED OFF t r Waveform 2. LED optical waveform TXD LED t pw (MAX.) Waveform 3. ...

Page 8

IR SIR Mode - VLED_A vs ILED 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 000.0E+0 20.0E-3 40.0E-3 60.0E-3 ILED (A) IR SIR Mode - Radiant Intensity vs ILED 000.0E+0 20.0E-3 40.0E-3 ...

Page 9

... HSDL-3021 Package Dimensions MOUNTING CENTER RC EMITTER AND 2.05 IrDA EMITTER 2.85 3.0 1.85 8 0.6 9 4.0 1.025 C L RECEIVER 2.5 1.175 2.55 4.0 8.0 2 PIN 1 PIN 2 PIN 3 PIN PIN 5 PIN 6 3.325 PIN 6.65 PIN 8 0.35 0.65 0.80 V LED IOV CC TxDR RxD ...

Page 10

... HSDL-3021 Tape and Reel Dimensions UNIT: mm POLARITY PIN 8: VLED PIN 1: GND 0.4 0.05 2.8 0.1 EMPTY (40 mm MIN.) LABEL 10 4.0 0.1 1.75 0.1 + 0.1 1.5 0 1.5 0.1 8.4 0.1 3.4 0.1 8.0 0.1 PROGRESSIVE DIRECTION PARTS MOUNTED LEADER (400 mm MIN.) EMPTY (40 mm MIN ...

Page 11

... HSDL-3021 Moisture Proof Packaging All HSDL-3021 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. UNITS IN A SEALED MOISTURE-PROOF PACKAGE IS OPENED YES NO BAKING IS NECESSARY PERFORM RECOMMENDED BAKING CONDITIONS Figure 3. Baking conditions chart. 11 PACKAGE (UNSEALED) ENVIRONMENT LESS THAN 30° ...

Page 12

... The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3021 pins are heated to a temperature of 150 C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited per second to allow for even heating of both the PC board and HSDL-3021 pins ...

Page 13

... Appendix A: HSDL-3021 SMT Assembly Application Note Solder Pad, Mask and Metal Stencil STENCIL APERTURE SOLDER MASK Figure 1. Stencil and PCBA. Recommended Land Pattern MOUNTING CENTER 0.10 1.75 0.6 0.35 Figure 2. 13 METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA MOUNTING CENTER 2 ...

Page 14

Recommended Metal solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inch 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no ...

Page 15

Appendix B: PCB Layout Suggestion The effects of EMI and power supply noise can potentially reduce the sensitivity of the receiver, resulting in reduced link distance. The PCB layout played an important role to obtain a good PSRR and EM ...

Page 16

NOISE SOURCES TO BE PLACED AS FAR AWAY FROM THE TRANSCEIVER AS POSSIBLE CX1 R 1 CX2 LAYER 3 BOTTOM LAYER (GND) The area underneath the module at the second layer, and all directions around the module, ...

Page 17

... Appendix C: General Application Guide for the HSDL-3021 infrared IrDA Compliant 4 Mb/s Transceiver Description The HSDL-3021, a wide-voltage operating range infrared transceiver is a low-cost and small form factor device that is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones ...

Page 18

... CC GPIO IR_RxD GPIO IR_TxD 100 kW 100 kW GND Figure 3: HSDL-3021 configuration with general mobile architecture processor. The transceiver is directly interfaced with the microprocessor provided its support infrared communication commonly known as Infrared Communications Port (ICP). The ICP supports both SIR data rates up to 115.2 kps and sometimes ...

Page 19

... Remote Control Operation The HSDL-3021 is spectrally suited to universal remote control transmission function at 940 nm typically. Remote control applications are not governed by any standards, owing to which there are numerous remote codes in market. Each of those standards results in receiver modules with different sensitivities, depending on the Table 3 ...

Page 20

... the width of the window the height of the window, and Z is the distance from the HSDL-3021 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens is 5.1 mm. The equations that determine the size of the window are as follows ...

Page 21

APERTURE WIDTH (X) vs. MODULE DEPTH MIN MODULE DEPTH (Z) – mm For the modules depth values that are not shown on the ...

Page 22

Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be ...

Page 23

... Appendix E: General Application Guide for the HSDL-3021 Remote Control Drive Modes The HSDL-3021 can operate in the single-TxD programmable mode or the two-TxD direct transmission mode. Single-TxD Programmable Mode In the single-TxD programmable mode, only one input pin (TxD_IR input pin) is used to drive the ...

Page 24

Two-TxD Direct Transmission Mode In the two-TxD direct transmission mode, the LED can be driven separately for IrDA and RC mode of operation through the TxD_IR and TxD_RC pins respectively. This mode can be used when the external controller utilizes ...

Page 25

... Power-Up Sequencing To have a proper operation for HSDL-3201, the following power-up sequencing must be followed strongly recommended that V prior to IOV . IOV DL CC IOV CC t SDDL not recommended to turn on IOV V while SD is low. However, for application CC that IOV comes prior pin has to be set high to assure proper functionality ...

Page 26

For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © ...

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