MT45W2MW16BGB-701 IT Micron Technology Inc, MT45W2MW16BGB-701 IT Datasheet - Page 61

• Manufacturer Part Number: MT45W2MW16BGB-701 IT
• Manufacturer: Micron Technology Inc

Specifications of MT45W2MW16BGB-701 IT

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Revision History
Rev. E, Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .09/08
Rev. D, Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .02/08
Rev. C, Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .07/07
Rev. B, Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .05/07
Rev. A, Preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .02/07
PDF: 09005aef82832fa2/Source: 09005aef82832f5f
32mb_burst_cr1_0_p24z_2.fm - Rev. E 9/08 EN
• “Options” on page 1: Added “Low Power: L” to table.
• Table 2, “Bus Operations: Asynchronous Mode,” on page 8: Changed note 1 from
• Table 3, “Bus Operations: Burst Mode,” on page 9: Changed note 1 from “CLK must
• Figure 26: “AC Input/Output Reference Waveform,” on page 35: Changed “V
• Figure 32: “Single-Access Burst READ Operation,” on page 43: Changed symbol for
• Figure 33: “4-Word Burst READ Operation,” on page 44: Changed symbol for LB#/
• Figure 34: “READ Burst Suspend,” on page 45: Changed symbol for LB#/UB# from
• Table 15, “Burst WRITE Cycle Timing Requirements,” on page 39: Corrected
• Renumbered the notes in Table 12 on page 36.
• Replaced “‘” with “2” in the “Notes” column in Table 12 on page 36.
• Changed revision status to Production.
• Removed “Contact factory” note from the “Options” section on page 1.
• Changed burst initial latency from “39ns” to “38.5ns” in the “Features” section on
• Removed “...(contact factory)” from Figure 3 on page 10.
• Moved the “WAIT Polarity (BCR[10]) Default = WAIT Active HIGH” section to page 29.
• Changed A6 and A5 to “Ignored” and added the following text in Figure 24 on page 31:
• Initial release.
“CLK must be low...” to “CLK must be static HIGH or LOW...”
be low...” to “CLK must be static HIGH or LOW...”
“V
at V
LB#/UB# from
UB# from
t
parameter label from minimum to maximum.
page 1.
“Setting is ignored (default 00b).”
CSP to
CC
CC
Q” in two instances in the diagram; revised note 2 to read, “Input timing begins
32Mb: 2 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
Q/2.”
t
SP.
t
CSP to
t
CSP to
t
SP.
t
SP.
61
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2007 Micron Technology, Inc. All rights reserved.
Revision History
CC
t
CEM
” to