XC3S500E-4FT256I Xilinx Inc, XC3S500E-4FT256I Datasheet - Page 8
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XC3S500E-4FT256I
Manufacturer Part Number
XC3S500E-4FT256I
Description
FPGA Spartan®-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S500E-4FT256I
Package
256FTBGA
Family Name
Spartan®-3E
Device Logic Cells
10476
Device Logic Units
1164
Device System Gates
500000
Number Of Registers
9312
Maximum Internal Frequency
572 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
190
Ram Bits
368640
Number Of Logic Elements/cells
10476
Number Of Labs/clbs
1164
Total Ram Bits
368640
Number Of I /o
190
Number Of Gates
500000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-LBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S500E-4FT256I
Manufacturer:
XILINX
Quantity:
1 400
Company:
Part Number:
XC3S500E-4FT256I
Manufacturer:
XILINX
Quantity:
360
Part Number:
XC3S500E-4FT256I
Manufacturer:
XILXIN
Quantity:
20 000
Revision History
The following table shows the revision history for this document.
8
03/01/05
03/21/05
11/23/05
03/22/06
11/09/06
04/18/08
08/26/09
Date
Version
1.0
1.1
2.0
3.0
3.4
3.7
3.8
Initial Xilinx release.
Added XC3S250E in CP132 package to
for CP132 package. Added package markings for QFP packages
CP132/CPG132 packages
Added differential HSTL and SSTL I/O standards. Updated
input-only pins. Added
diagrams.
Upgraded data sheet status to Preliminary. Added XC3S100E in CP132 package and
updated I/O counts for the XC3S1600E in FG320 package
about dual markings for –5C and –4I product combinations to
Added 66 MHz PCI support and links to the Xilinx PCI LogiCORE data sheet. Indicated that
Stepping 1 parts are Production status. Promoted Module 1 to Production status.
Synchronized all modules to v3.4.
Added XC3S500E VQG100 package. Added reference to
links.
Added paragraph to
Added package sizes to
guarantee for devices having a single mark in paragraph 3 under
Deleted Pb-Free Packaging example under
under
Production
Stepping. Revised description of
Configuration
www.xilinx.com
Production Stepping
Table
(Figure
2. Described the speed grade and temperature range
4).
indicating the device supports MultiBoot configuration.
Revision
Table
Ordering
information, including example top marking
2. Corrected number of differential I/O pairs
Table
Information. Revised information
XA Automotive
3.
(Table
Table 2
Package
DS312-1 (v3.8) August 26, 2009
Package
(Figure
2). Added information
to indicate number of
Product Specification
Marking.
version. Updated
2) and
Marking.
R