TDA8501T/N1,112 NXP Semiconductors, TDA8501T/N1,112 Datasheet - Page 28

• Manufacturer Part Number: TDA8501T/N1,112
• Manufacturer: NXP Semiconductors

Specifications of TDA8501T/N1,112

• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
April 1993
SO24: plastic small outline package; 24 leads; body width 7.5 mm
PAL/NTSC encoder
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT137-1
24
max.
1
2.65
0.10
Z
A
y
pin 1 index
0.012
0.004
0.30
0.10
A
1
0.096
0.089
2.45
2.25
A
2
075E05
IEC
0.25
0.01
A
e
3
D
0.019
0.014
0.49
0.36
b
p
MS-013AD
0.013
0.009
0.32
0.23
JEDEC
c
0
REFERENCES
15.6
15.2
0.61
0.60
D
(1)
b
p
0.30
0.29
E
7.6
7.4
(1)
13
12
w
scale
0.050
EIAJ
1.27
28
5
e
M
10.65
10.00
0.419
0.394
H
c
E
0.055
1.4
A
L
2
10 mm
A
1
0.043
0.016
1.1
0.4
L
p
0.043
0.039
1.1
1.0
Q
H
E
E
detail X
PROJECTION
EUROPEAN
0.25
0.01
v
L
L
p
Q
0.25
0.01
Preliminary specification
w
(A )
3
0.004
A
0.1
y
TDA8501
A
ISSUE DATE
95-01-24
97-05-22
0.035
0.016
X
Z
0.9
0.4
v
(1)
SOT137-1
M
A
8
0
o
o