TDA8501T/N1,112 NXP Semiconductors, TDA8501T/N1,112 Datasheet - Page 27

• Manufacturer Part Number: TDA8501T/N1,112
• Manufacturer: NXP Semiconductors

Specifications of TDA8501T/N1,112

• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
PACKAGE OUTLINES
April 1993
SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
PAL/NTSC encoder
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
SOT234-1
VERSION
OUTLINE
L
max.
4.7
A
Z
24
1
min.
0.51
pin 1 index
A
1
IEC
max.
3.8
A
2
1.3
0.8
b
e
D
0.53
0.40
JEDEC
b
1
REFERENCES
b
0
0.32
0.23
c
22.3
21.4
D
(1)
scale
EIAJ
27
5
E
9.1
8.7
13
12
b
(1)
1
A
1.778
1
w
e
10 mm
A
E
M
2
10.16
A
e
1
3.2
2.8
L
PROJECTION
EUROPEAN
c
10.7
10.2
M
E
Preliminary specification
(e )
M
M
12.2
10.5
H
M
1
E
H
TDA8501
ISSUE DATE
0.18
92-11-17
95-02-04
w
SOT234-1
max.
1.6
Z
(1)