ISP1102W-T NXP Semiconductors, ISP1102W-T Datasheet - Page 21

• Manufacturer Part Number: ISP1102W-T
• Description: RF Transceiver USB FULL SPD TRNSCVR
• Manufacturer: NXP Semiconductors

Specifications of ISP1102W-T

• Number Of Transceivers: 1
• Esd Protection: YeskV
• Operating Supply Voltage (typ): Not RequiredV
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (max): Not RequiredV
• Operating Supply Voltage (min): Not RequiredV
• Pin Count: 16
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Number Of Receivers: 1
• Number Of Transmitters: 1
• Operating Supply Voltage: 1.65 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: HBCC-16
• Maximum Data Rate: 12 Mbps
• Maximum Supply Current: 2 mA, 8 mA
• Minimum Operating Temperature: - 40 C
• Protocol Supported: USB 2.0
• Lead Free Status / RoHS Status: Compliant
• Other names: ISP1102W,118

NXP Semiconductors
ISP1102_5
Product data sheet
Table 16.
Table 17.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
Fig 15. Temperature profiles for large and small components
•
•
2.5
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16
MSL: Moisture Sensitivity Level
temperature
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
17
Rev. 05 — 11 December 2007
15.
= minimum soldering temperature
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
3
3
)
)
350 to 2000
260
250
245
220
220
350
Advanced USB transceiver
temperature
peak
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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