ISP1102W-T NXP Semiconductors, ISP1102W-T Datasheet
ISP1102W-T
Specifications of ISP1102W-T
Related parts for ISP1102W-T
ISP1102W-T Summary of contents
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IMPORTANT NOTICE Dear customer from August 2 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless result, the following changes are applicable to the attached document. ● Company name - NXP ...
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... I Two single-ended receivers with hysteresis I Low-power operation I Supports I/O voltage range from 1. 3 ElectroStatic Discharge (ESD) protection (for the ISP1102W) at the DP, DM, V CC(5V0) I Full industrial operating temperature range from + Available in HBCC16 and HVQFN14 lead-free and halogen-free packages or VREG3V3 is lost, the DP and DM pins can be shared with other serial ...
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... Personal Digital Assistant (PDA) N Information Appliance (IA) 4. Ordering information Table 1. Ordering information Type number Package Name Description ISP1102W HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 ISP1102BS HVQFN14 plastic thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 5. Block diagram Fig 1 ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning OE 1 RCV 2 VP/VPO 3 ISP1102W VM/VMO 4 SUSPEND 5 Transparent top view Fig 2. Pin configuration HBCC16 (top view) 6.2 Pin description Table 2. Pin description [1] Symbol Pin HBCC16 HVQFN14 RCV 2 2 VP/VPO 3 3 VM/VMO 4 4 ISP1102_5 Product data sheet ...
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... NXP Semiconductors Table 2. Pin description …continued [1] Symbol Pin HBCC16 HVQFN14 SUSPEND CC(I/O) VBUSDET VREG3V3 CC(5V0) VPU3V3 15 13 SOFTCON 16 14 GND exposed exposed die pad die pad [1] Symbol names with an overscore (for example, OE) indicate active LOW signals. ISP1102_5 Product data sheet ...
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... NXP Semiconductors 7. Functional description 7.1 Function selection Table 3. Function selection SUSPEND OE DP, DM LOW LOW driving or receiving LOW HIGH receiving HIGH LOW driving [1] HIGH HIGH high-Z [1] Signal levels on the DP and DM pins are determined by other USB devices and external pull-up or pull-down resistors. [2] In suspend mode (SUSPEND = HIGH), the differential receiver is inactive and output RCV is always LOW. The resume signaling is detected through single-ended receivers VP/VPO and VM/VMO ...
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... NXP Semiconductors Sharing mode — this mode, the DP and DM pins are 3-stated and the ISP1102 allows external signals 3 share the DP and DM lines. The internal circuits of the ISP1102 ensure that virtually no current (maximum drawn through the DP and DM lines. The power consumption through pin V Pins VBUSDET and RCV are driven to LOW to indicate this mode ...
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... NXP Semiconductors 7.4 Power supply input options The ISP1102 has two power supply input options. Internal regulator — Pin V used to supply the internal circuitry with 3.3 V (nominal). The VREG3V3 pin becomes a 3.3 V output reference. Regulator bypass — Pins V The internal regulator is bypassed and the internal circuitry is supplied directly from pin VREG3V3. The voltage range comply with Universal Serial Bus Specifi ...
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... NXP Semiconductors 8. ElectroStatic Discharge (ESD) 8.1 ESD protection For the HBCC package, the pins that are connected to the USB connector (DP, DM, V CC(5V0) is limited by the test equipment. Capacitors of 4.7 F connected from VREG3V3 to GND and V CC(5V0) HIGH VOLTAGE DC SOURCE Fig 4. Human body ESD test model ...
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... NXP Semiconductors 9. Limiting values Table 9. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage (5.0 V) CC(5V0) V input/output supply voltage CC(I/O) V input voltage I I latch-up current lu V electrostatic discharge esd voltage T storage temperature stg [1] Testing equipment limits measurement to only 12 kV. Capacitors needed on V [2] Equivalent to discharging a 100 pF capacitor through a 1 ...
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... NXP Semiconductors Table 11. Static characteristics: supply pins CC(5V0) (VREG3V3) level combinations +85 C; unless otherwise specified. amb Symbol Parameter I suspend supply current CC(susp) I sharing mode supply current CC(I/O)(sharing) on pin V CC(I/O) I sharing mode load current on load(sharing)DM pin DM I sharing mode load current on ...
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... NXP Semiconductors Table 12. Static characteristics: digital pins CC(I/O) GND Symbol Parameter Leakage current I input leakage current LI Capacitance C input capacitance in Example 1.8 V 0.15 V CC(I/O) Input levels V LOW-level input voltage IL V HIGH-level input voltage IH Output levels V LOW-level output voltage OL V HIGH-level output voltage ...
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... NXP Semiconductors Table 13. Static characteristics: analog I/O pins DP and 4 5 CC(5V0) (VREG3V3) Symbol Parameter V differential common mode CM voltage Single-ended receiver V LOW-level input voltage IL V HIGH-level input voltage IH V hysteresis voltage hys Output levels V LOW-level output voltage OL V HIGH-level output voltage R OH ...
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... NXP Semiconductors Table 14. Dynamic characteristics: analog I/O pins DP and 4 5 CC(5V0) (VREG3V3) level combinations +85 C; unless otherwise specified. amb Symbol Parameter Driver timing t driver propagation delay PLH(drv) (LOW to HIGH) t driver propagation delay PHL(drv) (HIGH to LOW) t HIGH to OFF-state PHZ propagation delay ...
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... NXP Semiconductors Fig 5. Rise time and fall time 1.8 V logic 0.9 V input PZH t PZL V OH differential V CRS data lines V OL Fig 7. Timing and DM ISP1102_5 Product data sheet 1.8 V logic input 004aab048 Fig 6. Timing of VPO and VMO to DP and DM differential data lines ...
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... NXP Semiconductors 13. Test information Fig 9. Load on pins DP and DM Fig 10. Load on pins DP and DM for enable time and disable time Fig 11. Load on pins VM/VMO, VP/VPO and RCV ISP1102_5 Product data sheet VPU3V3 DUT DP/DM Load capacitance (minimum or maximum timing) L DUT for t and t PZH ...
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... NXP Semiconductors 14. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the original dimensions UNIT max. 0.10 0.7 0.33 0.33 mm 0.8 0.05 0.6 0.27 0.27 OUTLINE VERSION IEC SOT639-2 Fig 12. Package outline SOT639-2 (HBCC16) ...
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... NXP Semiconductors HVQFN14: plastic thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 2.5 x 0.85 mm terminal 1 index area terminal 1 index area 14 DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 15. Packing information The ISP1102W (HBCC16 package) is delivered on a Type A carrier tape, see The tape dimensions are given in The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in baking process. The cumulative tolerance of 10 successive sprocket holes is 0.02 mm. The camber must not exceed 100 mm ...
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... NXP Semiconductors 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board ...
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... NXP Semiconductors • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) ...
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... ISP1102_5 20071211 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 7.3 “Power supply configurations” ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Table 12. Static characteristics: digital pins . . . . . . . . . . .10 Table 13. Static characteristics: analog I/O pins DP and .11 Table 14. Dynamic characteristics: analog I/O pins DP and .12 Table 15. Type A carrier tape dimensions for the ISP1102W . . . . . . . . . . . . . . . . . . . . . . . . .18 Table 16. SnPb eutectic process (from J-STD-020C .20 Table 17. Lead-free process (from J-STD-020C .20 Table 18. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .21 Table 19. Revision history . . . . . . . . . . . . . . . . . . . . . . . .21 ISP1102_5 Product data sheet Rev. 05 — ...
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... NXP Semiconductors 22. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Fig 2. Pin configuration HBCC16 (top view Fig 3. Pin configuration HVQFN14 (top view Fig 4. Human body ESD test model Fig 5. Rise time and fall time . . . . . . . . . . . . . . . . . . . . .14 Fig 6. Timing of VPO and VMO to DP and .14 Fig 7. Timing and .14 Fig 8 ...
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... NXP Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Function selection 7.2 Operating functions 7.3 Power supply configurations . . . . . . . . . . . . . . . 5 7.4 Power supply input options . . . . . . . . . . . . . . . . 7 8 ElectroStatic Discharge (ESD) ...