PIC18F23K20-E/SP Microchip Technology, PIC18F23K20-E/SP Datasheet - Page 427

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PIC18F23K20-E/SP

Manufacturer Part Number
PIC18F23K20-E/SP
Description
8 KB Enh Flash, 768 RAM, 25 I/O Pb Free, Nanowatt XLP 28 SPDIP .300in TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18F23K20-E/SP

Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
28.0
28.1
 2010 Microchip Technology Inc.
28-Lead SOIC (7.50 mm)
28-Lead PDIP
40-Lead PDIP
PACKAGING INFORMATION
Package Marking Information
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
Legend: XX...X
Note:
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
YYWWNNN
YYWWNNN
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Y
YY
WW
NNN
*
e
3
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
PIC18F2XK20/4XK20
Example
Example
Example
PIC18F25K20-E/SO
PIC18F25K20-E/SP
PIC18F45K20-E/P
e
3
0810017
0810017
0810017
e
3
e
)
3
DS41303G-page 427
e
3

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