PIC18F23K20-E/SP Microchip Technology, PIC18F23K20-E/SP Datasheet - Page 384

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PIC18F23K20-E/SP

Manufacturer Part Number
PIC18F23K20-E/SP
Description
8 KB Enh Flash, 768 RAM, 25 I/O Pb Free, Nanowatt XLP 28 SPDIP .300in TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18F23K20-E/SP

Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PIC18F2XK20/4XK20
26.12.2
The temperature and voltages specified in Table 26-5
apply to all timing specifications unless otherwise
noted. Figure 26-4 specifies the load conditions for the
timing specifications.
TABLE 26-5:
FIGURE 26-4:
26.12.3
FIGURE 26-5:
DS41303G-page 384
AC CHARACTERISTICS
CLKOUT
OSC1
TIMING CONDITIONS
TIMING DIAGRAMS AND SPECIFICATIONS
TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL)
Pin
Q4
Load Condition 1
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Operating voltage V
Section 26.9.
V
V
Q1
DD
SS
1
/2
R
C
L
L
DD
R
C
Q2
range as described in DC spec Section 26.1 and
L
L
= 464
= 50 pF
-40°C  T
2
3
Pin
A
Q3
for all pins except OSC2/CLKOUT
and including D and E outputs as ports
+125°C
Load Condition 2
3
Q4
V
4
SS
 2010 Microchip Technology Inc.
C
L
4
Q1

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