PIC18F2221-E/SO Microchip Technology, PIC18F2221-E/SO Datasheet - Page 333

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PIC18F2221-E/SO

Manufacturer Part Number
PIC18F2221-E/SO
Description
4KB, Flash, 512bytes-RAM, 25I/O, 8-bit Family,nanoWatt 28 SOIC .300in TUBE
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2221-E/SO

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
4KB (2K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
27.0
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
© 2009 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows:
2: Voltage spikes below V
ELECTRICAL CHARACTERISTICS
Pdis = V
latch-up. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/V
RE3 pin, rather than pulling this pin directly to V
DD
with respect to V
DD
IK
PIC18F2221/2321/4221/4321 FAMILY
OK
x {I
(V
DD
I
SS
(V
DD
< 0 or V
pin ..............................................................................................................................250 mA
O
pin ...........................................................................................................................300 mA
– ∑ I
< 0 or V
SS
OH
I
SS
SS
SS
> V
(†)
......................................................................................................... -0.3V to +7.5V
} + ∑ {(V
(Note 2) ......................................................................................... 0V to +13.25V
O
at the MCLR/V
(except V
DD
> V
)...................................................................................................................... ±20 mA
DD
DD
) .............................................................................................................. ±20 mA
DD
– V
and MCLR) ................................................... -0.3V to (V
OH
PP
) x I
/RE3 pin, inducing currents greater than 80 mA, may cause
OH
SS
} + ∑(V
.
OL
x I
OL
)
DS39689F-page 333
DD
+ 0.3V)
PP
/

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