218-40CT3 Wakefield Thermal Solutions, 218-40CT3 Datasheet - Page 8

• Manufacturer Part Number: 218-40CT3
• Description: HEATSINK ALUM BLACK SMD
• Manufacturer: Wakefield Thermal Solutions
• Series: 218r

Specifications of 218-40CT3

• Thermal Resistance: 21 C / W
• Height: 0.4" (10.16mm)
• Package Cooled: SMD
• Attachment Method: SMD Pad
• Outline: 22.86mm x 8.12mm
• Power Dissipation @ Temperature Rise: 2W @ 52°C
• Thermal Resistance @ Forced Air Flow: 21°C/W @ 200 LFM
• Thermal Resistance @ Natural: 31°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 22.86 mm L x 8 mm W x 10.16 mm H
• Designed For: SMT Devices
• Packages Cooled: TO-218 / TO-220
• Width: 22.9mm
• Heat Sink Material: Copper
• Mounting Type: PC Board Surface Mount
• Length: 8mm
• Body Plating: Matte Tin
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 21840CT3; 345-1082

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Material: Aluminum,
Black Anodized
MECHANICAL DIMENSIONS
6/14/07
240-118ABH-22
273-AB
274 SERIES
281 SERIES
10:55 AM
Standard
P/N
273-AB
273-ABE-01
273-ABE-02
Material: Aluminum, Black Anodized
Standard
P/N
274-1AB
274-1ABE-01
274-1ABE-02
274-2AB
274-2ABE-01
274-2ABE-02
274-3AB
274-3ABE-01
274-3ABE-02
281-1AB
281-2AB
Standard
P/N
240-118ABEH-22 1.180 (30.0)
240-118ABES-22 1.180 (30.0)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
274 & 281 SERIES
273 SERIES
240 SERIES
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
240-118ABS-22
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Height Above
Height Above
.375 (9.5)
.375 (9.5)
.375 (9.5)
.500 (12.7)
.500 (12.7)
.500 (12.7)
.250 (6.4)
.250 (6.4)
.250 (6.4)
.375 (9.5)
.500 (12.7)
.375 (9.5)
.375 (9.5)
.375 (9.5)
PC Board
PC Board
in. (mm)
in. (mm)
Height Above
PC Board
in. (mm)
Low-Cost, Low-Height Wavesolderable Heat Sinks
Labor-Saving Twisted Fin Heat Sinks
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.750 (19.1) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
.520 (13.2) x .750 (19.1)
Low-Cost, Low-Height Wavesolderable Heat Sinks
1.000 (25.4) x .500 (12.7)
1.000 (25.4) x .500 (12.7)
273-AB-01
Dimensions
Dimensions
Footprint
Footprint
in. (mm)
in. (mm)
Dimensions
Footprint
in. (mm)
240 SERIES
Dimensions: in. (mm)
273 SERIES
274 SERIES
274-XAB-01
Configuration
Configuration
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Vert./Horiz.
Mounting
Mounting
Configuration
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Vertical
Mounting
Vertical
Vertical
273-AB-02
Tab Options
Tab Options
Solderable
Solderable
Tab Options
Solderable
No Tab
No Tab
No Tab
No Tab
No Tab
No Tab
01
02
01
02
01
02
01
02
22
22
274-XAB-02
Clip/Mtg Hole
Clip/Mtg Slot
Mounting
Mounting
Mounting
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Mtg Hole
Style
Style
Style
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
Convection
49°C @ 2W
49°C @ 2W
49°C @ 2W
Convection
56°C @ 2W
56°C @ 2W
56°C @ 2W
50°C @ 2W
50°C @ 2W
50°C @ 2W
62°C @ 2W
62°C @ 2W
62°C @ 2W
56°C @ 2W
50°C @ 2W
Convection
55°C @ 4W
55°C @ 4W
Thermal Performance at Typical Load
Thermal Performance at Typical Load
NATURAL AND FORCED
Thermal Performance at Typical Load
NATURAL AND FORCED
Natural
Natural
Natural
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
7.2°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
9.0°C/W @ 400 LFM
8.0°C/W @ 400 LFM
7.0°C/W @ 400 LFM
5.3°C/W @ 400 LFM
5.3°C/W @ 400 LFM
Board Level
Heat Sinks
Convection
Convection
Convection
Forced
Forced
Forced
TO-218, TO-220
TO-220
TO-220
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