218-40CT3 Wakefield Thermal Solutions, 218-40CT3 Datasheet - Page 20

HEATSINK ALUM BLACK SMD

218-40CT3

Manufacturer Part Number
218-40CT3
Description
HEATSINK ALUM BLACK SMD
Manufacturer
Wakefield Thermal Solutions
Series
218r
Datasheets

Specifications of 218-40CT3

Thermal Resistance
21 C / W
Height
0.4" (10.16mm)
Package Cooled
SMD
Attachment Method
SMD Pad
Outline
22.86mm x 8.12mm
Power Dissipation @ Temperature Rise
2W @ 52°C
Thermal Resistance @ Forced Air Flow
21°C/W @ 200 LFM
Thermal Resistance @ Natural
31°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
22.86 mm L x 8 mm W x 10.16 mm H
Designed For
SMT Devices
Packages Cooled
TO-218 / TO-220
Width
22.9mm
Heat Sink Material
Copper
Mounting Type
PC Board Surface Mount
Length
8mm
Body Plating
Matte Tin
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
21840CT3
345-1082
WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed
circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
6/14/07
10:56 AM
Standard
P/N
647-1OABEP
647-15ABEP
647-175ABEP
647-20ABEP
647-25ABEP
Material: Aluminum, Black Anodized
Standard
P/N
657-10ABEP
657-15ABEP
657-20ABEP
657-25ABEP
Wave-solderable pins. Material: Aluminum, Black Anodized
657 SERIES
647 SERIES
Page 41
Height Above
PC Board “A”
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
in. (mm)
PC Board “A”
High-Performance Heat Sinks for Vertical Board Mounting
High-Performance Heat Sinks for Vertical Board Mounting
1.000 (25.4)
1.500 (38.1)
1.750 (44.5)
2.000 (50.8)
2.500 (63.5)
Height Above
in. (mm)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
Maximum Footprint
Maximum
Footprint
in. (mm)
(EXTRUSION PROFILE 5195)
in. (mm)
657 SERIES
(EXTRUSION PROFILE 6533)
657 SERIES
647 SERIES
Products section for thermal interface materials, 126 Series silicone-free thermal compounds,
and other accessories products.
Convection
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
Thermal Performance at Typical Load
Natural
42°C @ 6W
37°C @ 6W
34°C @ 6W
31°C @ 6W
25°C @ 6W
Thermal Performance at Typical Load
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
3.8°C/W @ 200 LFM
3.5°C/W @ 200 LFM
3.3°C/W @ 200 LFM
3.1°C/W @ 200 LFM
2.8°C/W @ 200 LFM
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
NATURAL AND FORCED
Convection
Convection
Forced
Forced
TO-220, TO-247, TO-218
Board Level
Heat Sinks
0.055 (24.95)
0.075 (34.02)
0.090 (40.82)
0.104 (47.17)
0.125 (56.70)
lbs. (grams)
0.0515 (23.36)
0.0760 (34.60)
0.1030 (47.00)
0.1250 (57.00)
lbs (grams)
Weight
TO-220
Weight
41

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