218-40CT3 Wakefield Thermal Solutions, 218-40CT3 Datasheet - Page 13

• Manufacturer Part Number: 218-40CT3
• Description: HEATSINK ALUM BLACK SMD
• Manufacturer: Wakefield Thermal Solutions
• Series: 218r

Specifications of 218-40CT3

• Thermal Resistance: 21 C / W
• Height: 0.4" (10.16mm)
• Package Cooled: SMD
• Attachment Method: SMD Pad
• Outline: 22.86mm x 8.12mm
• Power Dissipation @ Temperature Rise: 2W @ 52°C
• Thermal Resistance @ Forced Air Flow: 21°C/W @ 200 LFM
• Thermal Resistance @ Natural: 31°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Folded
• Dimensions: 22.86 mm L x 8 mm W x 10.16 mm H
• Designed For: SMT Devices
• Packages Cooled: TO-218 / TO-220
• Width: 22.9mm
• Heat Sink Material: Copper
• Mounting Type: PC Board Surface Mount
• Length: 8mm
• Body Plating: Matte Tin
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 21840CT3; 345-1082

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or
TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance,
a 271 Series heat sink can also be used for double-sided heat dissipation.
34
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
6/14/07
289 SERIES
270 SERIES
272 SERIES
Standard
P/N
270-AB
272-AB
280-AB
Material: Aluminum, Black Anodized
Standard
P/N
289-AB
289-AP
290-1AB
290-2AB
Material: Aluminum, Black Anodized
Low in cost and compact in overall dimensions, one 289 Series heat sink can
accommodate one semiconductor; the 289 Series is available with a black an-
270/272/280 SERIES
289 & 290 SERIES
10:55 AM
Height Above
MECHANICAL DIMENSIONS
0.375 (9.4)
0.375 (9.4)
0.375 (9.4)
PC Board
in. (mm)
Page 34
Height Above
0.500 (12.7)
0.500 (12.7)
0.500 (12.7)
0.500 (12.7)
PC Board
in. (mm)
1.750 (44.5) x 0.700 (17.8)
1.750 (44.5) x 1.450 (36.8)
1.750 (44.5) x 0.700 (17.8)
Low-Cost Single or Dual Package Heat Sinks
Small Footprint Low-Cost Heat Sinks
Horizontal Mounting
Maximum Footing
in. (mm)
280 SERIES
1.000 (25.4) x 0.710 (18.1)
1.000 (25.4) x 0.710 (18.1)
1.000 (25.4) x 1.180 (30.0)
1.000 (25.4) x 1.180 (30.0)
Horizontal Mounting
Maximum Footing
290 SERIES
in. (mm)
The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two
power semiconductors. Specify solderable tab options for the 272 Series by the addition of
suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02).
Tab Options
Solderable
01,02
Dimensions: in. (mm)
—
—
odized finish (289-AB) or with no finish (289-AP). Two semiconductors can be
mounted to the 290-2AB style.
70°C @ 4W
42°C @ 4W
70°C @ 4W
50°C @ 2W
50°C @ 2W
44°C @ 2W
44°C @ 2W
Convection
Convection
Thermal Performance at Typical Load
Thermal Performance at Typical Load
Natural
Natural
272AB01
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
NATURAL AND FORCED
6.0°C/W @ 400 LFM
3.6°C/W @ 400 LFM
6.0°C/W @ 400 LFM
9.0 C/W @ 400 LFM
9.0 C/W @ 400 LFM
7.0 C/W @ 400 LFM
7.0 C/W @ 400 LFM
Convection
Convection
Forced
Forced
272AB02
TO-218, TO-202, TO-220
TO-220, TO-202
0.0055 (2.49)
0.0055 (2.49)
0.0082 (3.72)
0.0081 (3.67)
lbs. (grams)
0.0052 (2.36)
0.0105 (5.72)
0.0048 (2.18)
lbs. (grams)
Weight
Weight