218-40CT3 Wakefield Thermal Solutions, 218-40CT3 Datasheet

HEATSINK ALUM BLACK SMD

218-40CT3

Manufacturer Part Number
218-40CT3
Description
HEATSINK ALUM BLACK SMD
Manufacturer
Wakefield Thermal Solutions
Series
218r
Datasheets
1.667-10ABPP.pdf (23 pages)
2.217-36CTRE6.pdf (17 pages)
3.274-1AB.pdf (23 pages)

Specifications of 218-40CT3

Thermal Resistance
21 C / W
Height
0.4" (10.16mm)
Package Cooled
SMD
Attachment Method
SMD Pad
Outline
22.86mm x 8.12mm
Power Dissipation @ Temperature Rise
2W @ 52°C
Thermal Resistance @ Forced Air Flow
21°C/W @ 200 LFM
Thermal Resistance @ Natural
31°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
22.86 mm L x 8 mm W x 10.16 mm H
Designed For
SMT Devices
Packages Cooled
TO-218 / TO-220
Width
22.9mm
Heat Sink Material
Copper
Mounting Type
PC Board Surface Mount
Length
8mm
Body Plating
Matte Tin
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
21840CT3
345-1082
WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Standard
P/N
217-36CTE6
217-36CTTE6
217-36CTRE6
Material: Copper, Matte Tin Plated
22
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
6/14/07
217-36CT6
Height Above
.360 (9.1)
.360 (9.1)
.360 (9.1)
PC Board
in. (mm)
10:54 AM
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Dimensions
Page 22
Footprint
in. (mm)
217 HEAT SINK WITH
DDPAK DEVICE
REEL DETAILS
SECTION A-A
KEY:
217 SERIES
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
í
Tape & Reel
Package
Device only, NC
Format
Bulk
Tube
Surface Mount Heat Sinks
v
Device + HS, NC
Package
Quantity
250
20
1
Device Power Dissipation. W
125°C LEAD, 40°C AMBIENT
TAPE DETAILS
THERMAL PERFORMANCE
6 LAYER BOARD, D ' PAK
Device + HS, 100 lfm
Convection
55°C @ 1W
55°C @ 1W
55°C @ 1W
Natural
Thermal Performance at Typical Load
„
Device + HS, 200 lfm
Dimensions: in.
D
2
PAK, TO-220, SOT-223, SOL-20
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
Convection)
Device + HS, 300 lfm
Forced

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218-40CT3 Summary of contents

Page 1

WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Height Above Footprint Standard PC Board Dimensions P/N in. (mm) in. (mm) 217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) 217-36CTTE6 .360 (9.1) .600 ...

Page 2

... Forced Convection 62°C rise @ 2W 21°C/W @ 200LFM 62°C rise @ 2W 21°C/W @ 200LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) 0 200 400 600 800 1000 200 400 600 800 1000 0.5 1.0 1.5 2.0 2.5 HEAT DISSIPATED (WATTS) Dashed Line = 218-40CT3 23 ...

Page 3

WTS001_p1-25 6/14/07 10:54 AM Page 24 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Vertical Mount Heat Sink 206 SERIES Standard P/N 206-1PABEH Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 230 & 234 SERIES Height Above Standard PC Board ...

Page 4

WTS001_p1-25 6/14/07 10:54 AM Page 25 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 241 SERIES Standard P/N 241-69ABE-03 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 262 SERIES Standard P/N 262-75ABE-05 262-75ABE-01 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Horizontal Mount Heat Sink Height ...

Page 5

WTS001_p26-49 6/14/07 10:55 AM Page 26 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 & 236 SERIES Height Above Standard PC Board P/N in. (mm) 233-60AB .600 (15.2) 233-60ABE-01 .600 (15.2) 233-60ABE-05 .500 (12.7) 233-60ABE-10 .725 (18.4) ...

Page 6

WTS001_p26-49 6/14/07 10:55 AM Page 27 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Height Above Standard P/N 235-85AB 235-85ABE-01 235-85ABE-05 235-85ABE-10 PATENT 5381041 Material: Aluminum, Black Anodized 235-85AB-05 243 SERIES Height Above Standard P/N 243-1PAB 243-3PAB Material: Aluminum, Pre-anodized ...

Page 7

WTS001_p26-49 6/14/07 10:55 AM Page 28 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Vertical Mount Heat Sink 265 SERIES Standard P/N 265-118ABHE-22 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 286DB SERIES Standard P/N 286DBE Material: Aluminum, Black Anodized ...

Page 8

... PC Board Dimensions Mounting in. (mm) in. (mm) Configuration 1.000 (25.4) x .500 (12.7) Vertical 1.000 (25.4) x .500 (12.7) Vertical 240 SERIES Board Level Heat Sinks TO-218, TO-220 Thermal Performance at Typical Load Solderable Mounting Natural Forced Tab Options Style Convection Convection No Tab Mtg Hole 49° 7.2° ...

Page 9

WTS001_p26-49 6/14/07 10:55 AM Page 30 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Low-Height, Low-Profile Twisted Fin Heat Sinks 242 SERIES Height Above Standard PC Board P/N in. (mm) 242-125ABE-22 1.285 (32.6) Material: Aluminum, Black Anodized 242-125AB-22 ...

Page 10

... WTS001_p26-49 6/14/07 10:55 AM Page 31 BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 244 SERIES Standard P/N 244-145AB 244-145ABE-50 1.650 (41.9) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 245 SERIES Standard P/N 245-145AB 245-145ABE-50 1.650 (41.9) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in ...

Page 11

... WTS001_p26-49 6/14/07 10:55 AM Page 32 Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks 247 SERIES Height Above Standard PC Board P/N in. (mm) 247-195AB 1.950 (49.5) 247-195ABE-50 1.950 (49.5) Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). ...

Page 12

WTS001_p26-49 6/14/07 10:55 AM Page 33 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Standard P/N 288-1ABE Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconduc- tor packages. ...

Page 13

... LFM 0.0052 (2.36) 3.6°C/W @ 400 LFM 0.0105 (5.72) 6.0°C/W @ 400 LFM 0.0048 (2.18) NATURAL AND FORCED CONVECTION CHARACTERISTICS 272AB02 TO-218, TO-202, TO-220 Forced Weight Convection lbs. (grams) 9.0 C/W @ 400 LFM 0.0055 (2.49) 9.0 C/W @ 400 LFM 0.0055 (2.49) 7 ...

Page 14

WTS001_p26-49 6/14/07 10:55 AM Page 35 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES Standard P/N 250-122AB 250-122ABE-09 250-122ABE-25 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 250-122AB Dimensions: in. (mm) 237 & 252 SERIES Standard P/N 237-167AB2 237-167AB3 237-167ABE2-24 1.675 (42.5) ...

Page 15

WTS001_p26-49 6/14/07 10:55 AM Page 36 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks 286 SERIES See also 286DB Series on Page 7. Height Above Standard PC Board P/N in. (mm) ...

Page 16

WTS001_p26-49 6/14/07 10:55 AM Page 37 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 695 SERIES Standard P/N 695-1B Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with ...

Page 17

WTS001_p26-49 6/14/07 10:56 AM Page 38 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Epoxy Insulated For TO-5 260 SERIES 260-4T5E Thermal Links for Fused Glass Diodes 258 SERIES Standard P/N 258 0.500 (12.7) x 0.250 (6.4) x ...

Page 18

... Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti- cally mounting TO-220 and TO-218 components. Models are available with or without wave- MECHANICAL DIMENSIONS Notes: 1. Thermal compound is as- sumed between device and heat sink ...

Page 19

... Nominal 0 0 Force Installed POWER DISSIPATION (WATTS) TO-218, TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 76° 5.8°C/W @ 200 LFM 65° 5.5°C/W @ 200 LFM 55° 4.7°C/W @ 200 LFM 48° 4.2°C/M @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS ...

Page 20

... LFM 0.104 (47.17) 25° 2.8°C/W @ 200 LFM 0.125 (56.70) NATURAL AND FORCED CONVECTION CHARACTERISTICS TO-220, TO-247, TO-218 Thermal Performance at Typical Load Natural Forced Convection Convection lbs (grams) 41° 3.7°C/W @ 200 LFM 0.0515 (23.36) 38° ...

Page 21

... LFM 38° 3.3°C/W @ 200 LFM 32° 2.9°C/W @ 200 LFM 25° 2.7°C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS TO-218, TO-220, TO-247 15-LEAD Multiwatt Thermal Performance at Typical Load Natural Forced Convection Convection 52° 3.1°C/W @ 200 LFM 46° ...

Page 22

WTS001_p26-49 6/14/07 10:56 AM Page 43 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES Standard P/N 690-3B 690-66B 690-220B Material: Aluminum, Black Anodized These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available ...

Page 23

WTS001_p26-49 6/14/07 10:56 AM Page 44 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 & 603 SERIES Footprint Standard Dimensions P/N in. (mm) 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 ...

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