217-36CT6 Wakefield Thermal Solutions, 217-36CT6 Datasheet - Page 3

• Manufacturer Part Number: 217-36CT6
• Description: HEATSINK DPAK SMT TIN PLATED
• Manufacturer: Wakefield Thermal Solutions
• Series: 217r

Specifications of 217-36CT6

• Thermal Resistance: 16 C / W
• Height: 0.360" (9.14mm)
• Package Cooled: D²Pak
• Attachment Method: SMD Pad
• Outline: 18.80mm x 15.20mm
• Power Dissipation @ Temperature Rise: 1W @ 55°C
• Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 55°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Copper
• Fin Style: Folded
• Dimensions: 15.24 mm L x 18.8 mm W x 9.91 mm H
• Designed For: D2Pak, TO-220, SOT-223, SOL-20
• Packages Cooled: SOL-20 / SOT-223 / TO-220
• Width: 18.8mm
• Heat Sink Material: Copper
• Peak Reflow Compatible (260 C): No
• Length: 15.2mm
• Size: 0.390H X 0.600W X 0.740D"
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
• Other names: 345-1012

WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
24
MECHANICAL DIMENSIONS
PATENT PENDING
Board Level
Heat Sinks
Dimensions: in. (mm)
234 SERIES
MECHANICAL DIMENSIONS
234-75AB
6/14/07
Standard
P/N
230-75AB
230-75ABE-01
230-75ABE-05
230-75ABE-10
234-75AB
234-75ABE-01
234-75ABE-05
Material: Aluminum, Black Anodized
Standard
P/N
206-1PABEH
Material: Aluminum, Black Anodized
230 & 234 SERIES
206 SERIES
10:54 AM
230-75AB-01
Height Above
.750 (19.1)
.750 (19.1)
.500 (12.7)
.875 (22.2)
.790 (20.0)
.790 (20.0)
.500 (12.7)
PC Board
in. (mm)
Page 24
234-75AB-01
Vertical Mount Heat Sink
230-75AB-10
Height Above
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
1.18 (30.0)
PC Board
in. (mm)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.750 (19.1) x .570 (14.5)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.570 (14.5) x .500 (12.7)
.790 (20.0) x .570 (14.5)
Dimensions
Footprint
in. (mm)
230 AND 234 SERIES
234-75AB-05
1.00 (25.4) x .50 (12.7)
Configuation
Vert./Horiz.
Vert./Horiz
Horizontal
Horizontal
Mounting
Maximum
Vertical
Vertical
Vertical
Footprint
in. (mm)
100
80
60
40
20
Solderable
0
230-75AB-05
Option
No Tab
No Tab
234 SERIES
0
0
Tab
01
05
10
01
05
CONVECTION CHARACTERISTICS
200
200
2
Natural Convection
NATURAL AND FORCED
56°C rise @ 4W
HEAT DISSIPATED (WATTS)
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Mounting
AIR VELOCITY (LFM)
Style
400
400
4
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
600
600
6
Thermal Performance at Typical Load
NATURAL AND FORCED
Convection
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
Natural
800
800
8
230 SERIES
1000
1000
10
7.3°C/W @ 200LFM
Forced Convection
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
10
8
6
4
2
0
Convection)
Forced
TO-220
TO-220