217-36CT6 Wakefield Thermal Solutions, 217-36CT6 Datasheet - Page 21

• Manufacturer Part Number: 217-36CT6
• Description: HEATSINK DPAK SMT TIN PLATED
• Manufacturer: Wakefield Thermal Solutions
• Series: 217r

Specifications of 217-36CT6

• Thermal Resistance: 16 C / W
• Height: 0.360" (9.14mm)
• Package Cooled: D²Pak
• Attachment Method: SMD Pad
• Outline: 18.80mm x 15.20mm
• Power Dissipation @ Temperature Rise: 1W @ 55°C
• Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 55°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Copper
• Fin Style: Folded
• Dimensions: 15.24 mm L x 18.8 mm W x 9.91 mm H
• Designed For: D2Pak, TO-220, SOT-223, SOL-20
• Packages Cooled: SOL-20 / SOT-223 / TO-220
• Width: 18.8mm
• Heat Sink Material: Copper
• Peak Reflow Compatible (260 C): No
• Length: 15.2mm
• Size: 0.390H X 0.600W X 0.740D"
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
• Other names: 345-1012

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
42
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Board Level
Heat Sinks
Dimensions: in. (mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
6/14/07
Standard
P/N
657-10ABEPN
657-15ABEPN
657-20ABEPN
657-25ABEPN
Wave-solderable pins. Material: Aluminum, Black Anodized
Standard
P/N
657-10ABEPSC
657-15ABEPSC
657-20ABEPSC
657-25ABEPSC
Wave-solderable pins. Material: Aluminum, Black Anodized
Standard
P/N
677-10ABEP
677-15ABEP
677-20ABEP
677-25ABEP
Wave-solderable pins. Material: Aluminum, Black Anodized
657 SERIES
657 SERIES
677 SERIES
10:56 AM
(EXTRUSION PROFILE 8719)
Page 42
High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting
High-Performance, High-Power Heat Sinks for Vertical Board Mounting
High-Performance Notched Heat Sinks for Vertical Board Mounting
657 SERIES
677 SERIES
677 SERIES
Height Above
PC Board “A”
Height Above
PC Board “A”
Height Above
PC Board “A”
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
in. (mm)
in. (mm)
in. (mm)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
(EXTRUSION PROFILE 6533)
Maximum
Maximum
Maximum
Footprint
in. (mm)
Footprint
in. (mm)
Footprint
in. (mm)
(EXTRUSION PROFILE 6533)
657 SERIES
657 SERIES
657 SERIES
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
52°C @ 6W
46°C @ 6W
40°C @ 6W
35°C @ 6W
Convection
Convection
Convection
Natural
Natural
Natural
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
Thermal Performance at Typical Load
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
TO-218, TO-220, TO-247
15-LEAD Multiwatt
TO-220, TO-247, TO-218
TO-220, TO-247, TO-218
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
3.1°C/W @ 200 LFM
2.8°C/W @ 200 LFM
2.5°C/W @ 200 LFM
2.2°C/W @ 200 LFM
Convection
Convection
Convection
Forced
Forced
Forced