217-36CT6 Wakefield Thermal Solutions, 217-36CT6 Datasheet - Page 2

HEATSINK DPAK SMT TIN PLATED

217-36CT6

Manufacturer Part Number
217-36CT6
Description
HEATSINK DPAK SMT TIN PLATED
Manufacturer
Wakefield Thermal Solutions
Series
217r
Datasheets

Specifications of 217-36CT6

Thermal Resistance
16 C / W
Height
0.360" (9.14mm)
Package Cooled
D²Pak
Attachment Method
SMD Pad
Outline
18.80mm x 15.20mm
Power Dissipation @ Temperature Rise
1W @ 55°C
Thermal Resistance @ Forced Air Flow
16.0°C/W @ 200 LFM
Thermal Resistance @ Natural
55°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Copper
Fin Style
Folded
Dimensions
15.24 mm L x 18.8 mm W x 9.91 mm H
Designed For
D2Pak, TO-220, SOT-223, SOL-20
Packages Cooled
SOL-20 / SOT-223 / TO-220
Width
18.8mm
Heat Sink Material
Copper
Peak Reflow Compatible (260 C)
No
Length
15.2mm
Size
0.390H X 0.600W X 0.740D"
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
Other names
345-1012
WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
MECHANICAL DIMENSIONS
Dimensions: in.
217 SERIES
TUBE: 16.25 Inches Long,
20 Pieces per Tube
6/14/07
MECHANICAL DIMENSIONS
Min. ESD Material with Nail
Stops
TUBE DETAILS
217-36CTT6
10:54 AM
218-40CT3
Surface Mount Heat Sinks
Standard
P/N
218-40CTE3
218-40CTE5
Material: Copper, Matte Tin Plated
218 SERIES
Page 23
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
Surface Mount Heat Sink
BOARD LAYOUT RECOMMENDATIONS
Height Above
PC Board
.40 (10.2)
.40 (10.2)
in. (mm)
218-40CT5
1.03 (26.2) x .50 (12.7)
.90 (22.9) x .315 (8.0)
Maximum
Footprint
in. (mm)
SOL 20
100
80
60
40
20
0
Solid line = 218-40CT5
0
0
200
200
CONVECTION CHARACTERISTICS
0.5
Natural Convection
62°C rise @ 2W
62°C rise @ 2W
HEAT DISSIPATED (WATTS)
NATURAL AND FORCED
AIR VELOCITY (LFM)
400
400
1.0
Thermal Performance at Typical Load
Dashed Line = 218-40CT3
600
600
1.5
800
800
2.0
217-36CT6
D
1000
1000
2.5
2
PAK, TO-220, SOL-20
Board Level
21°C/W @ 200LFM
21°C/W @ 200LFM
Forced Convection
25
20
15
10
5
0
Heat Sinks
SMT Devices
23

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