217-36CT6 Wakefield Thermal Solutions, 217-36CT6 Datasheet - Page 19

• Manufacturer Part Number: 217-36CT6
• Description: HEATSINK DPAK SMT TIN PLATED
• Manufacturer: Wakefield Thermal Solutions
• Series: 217r

Specifications of 217-36CT6

• Thermal Resistance: 16 C / W
• Height: 0.360" (9.14mm)
• Package Cooled: D²Pak
• Attachment Method: SMD Pad
• Outline: 18.80mm x 15.20mm
• Power Dissipation @ Temperature Rise: 1W @ 55°C
• Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 55°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Copper
• Fin Style: Folded
• Dimensions: 15.24 mm L x 18.8 mm W x 9.91 mm H
• Designed For: D2Pak, TO-220, SOT-223, SOL-20
• Packages Cooled: SOL-20 / SOT-223 / TO-220
• Width: 18.8mm
• Heat Sink Material: Copper
• Peak Reflow Compatible (260 C): No
• Length: 15.2mm
• Size: 0.390H X 0.600W X 0.740D"
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
• Other names: 345-1012

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
(34.9) REF
1.375
40
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Board Level
Heat Sinks
0.062
(1.6) REF
Dimensions: in. (mm)
0.500
(12.7) REF
(18.5)
0.730
6/14/07
RAISED BOSS x 0.030 (0.8) HIGH
0.125 (3.2) DIA
Standoff Pin
667-10ABESP
667-15ABESP
667-20ABESP
667-25ABESP
Wave-solderable pins. Material: Aluminum, Black Anodized
Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost.
Note: Order 330 SC or 285 SC SpeedClip™ separately.
Standard
P/N
626-10ABEP
626-15ABEP
626-20ABEP
626-25ABEP
Wave-solderable pins. Material: Aluminum, Black Anodized
667 SERIES
626 & 627 SERIES
10:56 AM
Standard P/N
A
(17.0)
0.670
667-10ABPP
667-15ABPP
667-20ABPP
667-25ABPP
Plain Pin
Page 40
627-10ABP
627-15ABP
627-20ABP
627-25ABP
(NOMINAL)
Standard
Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting
0.180
(4.6)
0.093
(2.4)
P/N
0.044 (1.1) (STANDOFF)
0.130 (3.3)
DIA
DIA
1.000
(25.4)
High-Efficiency Heat Sinks for Vertical Board Mounting
Height Above
PC Board “A”
STANDOFF
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
in. (mm)
PINS
"SP"
PC Board “A”
Height Above
2.500 (63-5)
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
626 AND 627 SERIES
Dimensions: in. (mm)
in. (mm)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
0.093
(2.4) DIA
(EXTRUSION PROFILE 8073)
Maximum
Footprint
in. (mm)
0.156
(4.0)
667 SERIES
PLAIN
PINS
"PP"
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
1.375 (34.9) x .500 (12.7)
Maximum
Footprint
in. (mm)
Thermal Performance at Typical Load
76°C @ 6W
66°C @ 6W
58°C @ 6W
48°C @ 6W
Convection
Natural
Nominal
Installed
Nominal
Installed
330SC
285SC
Speed
Force
Speed
Force
10 lb
Clip
4 lb
Clip
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
100
80
60
40
20
Convection
0
CONVECTION CHARACTERISTICS
Thermal Performance at Typical Load
0
0
Convection
76°C @ 6W
65°C @ 6W
55°C @ 6W
48°C @ 6W
Forced
Natural
NATURAL AND FORCED
POWER DISSIPATION (WATTS)
200
4
AIR VELOCITY (FPM)
400
8
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/M @ 200 LFM
600
12
0.0240 (11.0)
0.0340 (15.6)
0.0460 (21.0)
0.0580 (26.2)
Convection
lbs (grams)
TO-218, TO-220
Forced
800
Weight
16
TO-220
1000
20
5
4
3
2
1
0