PDTA115EE,115 NXP Semiconductors, PDTA115EE,115 Datasheet - Page 4

• Manufacturer Part Number: PDTA115EE,115
• Description: TRANS PNP W/RES 50V SOT-416
• Manufacturer: NXP Semiconductors

Specifications of PDTA115EE,115

• Package / Case: SC-75, SOT-416
• Transistor Type: PNP - Pre-Biased
• Current - Collector (ic) (max): 20mA
• Voltage - Collector Emitter Breakdown (max): 50V
• Resistor - Base (r1) (ohms): 100K
• Resistor - Emitter Base (r2) (ohms): 100K
• Dc Current Gain (hfe) (min) @ Ic, Vce: 80 @ 5mA, 5V
• Vce Saturation (max) @ Ib, Ic: 150mV @ 250µA, 5mA
• Current - Collector Cutoff (max): 1µA
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Configuration: Single
• Transistor Polarity: PNP
• Typical Input Resistor: 100 KOhm
• Typical Resistor Ratio: 1
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 50 V
• Peak Dc Collector Current: 20 mA
• Power Dissipation: 150 mW
• Maximum Operating Temperature: + 150 C
• Emitter- Base Voltage Vebo: - 10 V
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-2106-2; 934058177115; PDTA115EE T/R

NXP Semiconductors
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.
2004 Jul 30
PDTA115EE
PDTA115EEF
PDTA115EK
PDTA115EM
PDTA115ES
PDTA115ET
PDTA115EU
V
V
V
V
I
I
P
T
T
T
O
CM
SYMBOL
stg
j
amb
CBO
CEO
EBO
I
tot
PNP resistor-equipped transistors;
R1 = 100 kΩ, R2 = 100 kΩ
TYPE NUMBER
collector-base voltage
collector-emitter voltage
emitter-base voltage
input voltage
output current (DC)
peak collector current
total power dissipation
storage temperature
junction temperature
operating ambient temperature
positive
negative
SOT23
SOT54
SOT323
SOT346
SOT416
SOT490
SOT883
PARAMETER
NAME
−
−
−
−
−
−
−
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
leadless ultra small plastic package; 3 solder lands; body
1.0 × 0.6 × 0.5 mm
plastic single-ended leaded (through hole) package; 3 leads
plastic surface mounted package; 3 leads
plastic surface mounted package; 3 leads
open emitter
open base
open collector
T
note 1
note 1
note 1
note 1
note 1
notes 1 and 2
notes 2 and 3
amb
≤ 25 °C
4
CONDITIONS
PACKAGE
DESCRIPTION
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−65
−
−65
MIN.
PDTA115E series
−50
−50
−10
+10
−40
−20
−100
250
500
200
250
150
250
250
+150
150
+150
MAX.
Product data sheet
VERSION
SOT416
SOT490
SOT346
SOT883
SOT323
V
V
V
V
V
mA
mA
mW
mW
mW
mW
mW
mW
mW
°C
°C
°C
SOT54
SOT23
UNIT