MPC8536DS Freescale, MPC8536DS Datasheet - Page 125

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MPC8536DS

Manufacturer Part Number
MPC8536DS
Description
Manufacturer
Freescale
Datasheet

Specifications of MPC8536DS

Lead Free Status / RoHS Status
Compliant
5.2
The mechanical dimensions and bottom surface nomenclature of the MPC8536E, 783 FC-PBGA package are shown in
Figure
Freescale Semiconductor
1.
2.
3.
4.
5.
6.
7.
Figure 81. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8536E FC-PBGA
81.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Capacitors may not be present on all devices
Caution must be taken not to short exposed metal capacitor pads on package top.
All dimensions are symmetric across the package center lines, unless dimensioned otherwise.
Mechanical Dimensions of the MPC8536E FC-PBGA
MPC8536E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2
NOTES for
Figure 81
Mechanical Dimensions of the MPC8536E FC-PBGA
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