MPC8536DS Freescale, MPC8536DS Datasheet - Page 113

• Manufacturer Part Number: MPC8536DS
• Manufacturer: Freescale

Specifications of MPC8536DS

• Lead Free Status / RoHS Status: Compliant

2.24.3
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material.
The recommended attachment method to the heat sink is illustrated in
printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45
Newton).
The system board designer can choose between several types of heat sinks to place on the device. Ultimately, the final selection
of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,
attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha
Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, that will allow the MPC8536E to function in various environments.
2.24.3.1
For the packaging technology, shown in
Freescale Semiconductor
•
•
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Management Information
Internal Package Conduction Resistance
MPC8536E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2
Thermal Interface Material
Printed-Circuit Board
Table
Heat Sink
Heat Sink
70, the intrinsic internal conduction thermal resistance paths are as follows:
Clip
Die
Figure
FC-PBGA Package
73. The heat sink should be attached to the
Thermal
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