XC5VLX330-2FFG1760C Xilinx Inc, XC5VLX330-2FFG1760C Datasheet - Page 189

• Manufacturer Part Number: XC5VLX330-2FFG1760C
• Description: FPGA Virtex®-5 Family 331776 Cells 65nm (CMOS) Technology 1V 1760-Pin FCBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-5 LXr

Specifications of XC5VLX330-2FFG1760C

• Package: 1760FCBGA
• Family Name: Virtex®-5
• Device Logic Units: 331776
• Typical Operating Supply Voltage: 1 V
• Maximum Number Of User I/os: 1200
• Ram Bits: 10616832
• Number Of Logic Elements/cells: 331776
• Number Of Labs/clbs: 25920
• Total Ram Bits: 10616832
• Number Of I /o: 1200
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 1760-BBGA, FCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: HW-V5-ML525-UNI-G - EVAL PLATFORM ROCKET IO VIRTEX-5HW-AFX-FF1760-500-G - BOARD DEV VIRTEX 5 FF1760
• Number Of Gates: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Virtex-5 FPGA User Guide
UG190 (v5.3) May 17, 2010
X-Ref Target - Figure 5-14
Distributed RAM configurations greater than the provided examples require more than
one SLICEM. There are no direct connections between slices to form larger distributed
RAM configurations within a CLB or between slices.
WCLK
A[7:0]
WE
D
(WE/CE)
Figure 5-14: Distributed RAM (RAM256X1S)
(CLK)
www.xilinx.com
6
8
6
8
6
8
6
8
DI1
A[6:1]
WA[8:1]
CLK
WE
DI1
A[6:1]
WA[8:1]
CLK
WE
DI1
A[6:1]
WA[8:1]
CLK
WE
DI1
A[6:1]
WA[8:1]
CLK
WE
RAM256X1S
SPRAM64
SPRAM64
SPRAM64
SPRAM64
O6
O6
O6
O6
F7BMUX
F7AMUX
A6 (AX)
A6 (CX)
F8MUX
A7 (BX)
O
D Q
CLB Overview
(Optional)
UG190_5_14_050506
Output
Registered
Output
189