72T1875L5BBI Integrated Device Technology (Idt), 72T1875L5BBI Datasheet - Page 33

• Manufacturer Part Number: 72T1875L5BBI
• Description: FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 16K x 18/32K x 9 144-Pin BGA
• Manufacturer: Integrated Device Technology (Idt)

Specifications of 72T1875L5BBI

• Package: 144BGA
• Configuration: Dual
• Bus Directional: Uni-Directional
• Density: 288 Kb
• Organization: 16Kx18|32Kx9
• Data Bus Width: 9/18 Bit
• Timing Type: Asynchronous|Synchronous
• Expansion Type: Depth|Width
• Typical Operating Supply Voltage: 2.5 V
• Operating Temperature: -40 to 85 °C

HIGH-IMPEDANCE
as well as three-state types) of an IC to a disabled (high-impedance) state and
selects the one-bit bypass register to be connected between TDI and TDO.
During this instruction, data can be shifted through the bypass register from TDI
to TDO without affecting the condition of the IC outputs.
IDT72T1845/55/65/75/85/95/105/115/125 2.5V TeraSync™ 18-BIT/9-BIT FIFO
8Kx9, 8Kx18/16Kx9, 16Kx18/32Kx9, 32Kx18/64Kx9, 64Kx18/128Kx9, 128Kx18/256Kx9, 256Kx18/512Kx9, 512Kx18/1Mx9
The optional High-Impedance instruction sets all outputs (including two-state
33
BYPASS
functional mode and selects the one-bit bypass register to be connected
between TDI and TDO. The BYPASS instruction allows serial data to be
transferred through the IC from TDI to TDO without affecting the operation of
the IC.
The required BYPASS instruction allows the IC to remain in a normal
2Kx18/4Kx9, 4Kx18/
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
FEBRUARY 10, 2009