MT48H8M16LFB4-75 IT:K Micron Technology Inc, MT48H8M16LFB4-75 IT:K Datasheet - Page 14
![DRAM Chip Mobile SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA Tray](/photos/31/34/313423/557-54-vfbga_sml.jpg)
MT48H8M16LFB4-75 IT:K
Manufacturer Part Number
MT48H8M16LFB4-75 IT:K
Description
DRAM Chip Mobile SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet
1.MT48H8M16LFB4-6K.pdf
(86 pages)
Specifications of MT48H8M16LFB4-75 IT:K
Package
54VFBGA
Density
128 Mb
Address Bus Width
14 Bit
Operating Supply Voltage
1.8 V
Maximum Clock Rate
133 MHz
Maximum Random Access Time
8|5.4 ns
Operating Temperature
-40 to 85 °C
Organization
8Mx16
Address Bus
14b
Access Time (max)
8/5.4ns
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
70mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
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- Download datasheet (3Mb)
Figure 6: 90-Ball VFBGA (8mm x 13mm)
PDF: 09005aef832ff1ea
128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN
Dimensions apply
to solder balls post-
reflow. Pre-reflow
balls are Ø0.42 on
Ø0.4 SMD ball pads.
Seating
90X Ø0.45
plane
0.1 A
11.2
0.8 TYP
5.6
A
Note:
9
8
3.2
7
1. All dimensions are in millimeters.
8 ±0.1
6.4
Ball A1 ID
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM
6.5 ±0.05
0.65 ±0.05
0.8 TYP
14
13 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1%Ag, 0.5% Cu)
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID
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