MT48H8M16LFB4-75 IT:K Micron Technology Inc, MT48H8M16LFB4-75 IT:K Datasheet - Page 13

• Manufacturer Part Number: MT48H8M16LFB4-75 IT:K
• Description: DRAM Chip Mobile SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA Tray
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M16LFB4-75 IT:K

• Package: 54VFBGA
• Density: 128 Mb
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Clock Rate: 133 MHz
• Maximum Random Access Time: 8|5.4 ns
• Operating Temperature: -40 to 85 °C
• Organization: 8Mx16
• Address Bus: 14b
• Access Time (max): 8/5.4ns
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 70mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Package Dimensions
Figure 5: 54-Ball VFBGA (8mm x 8mm)
PDF: 09005aef832ff1ea
128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN
Dimensions apply
to solder balls
post-reflow. Pre-
reflow balls are
Ø0.42 on Ø0.4
SMD ball pads.
Exposed plated
features in all
corners are floating
nonbiased metal.
Seating
plane
54X Ø0.45
6.4
0.1 A
0.8 TYP
3.2
Note:
A
9
8
1. All dimensions are in millimeters.
3.2
7
8 ±0.1
6.4
4 ±0.05
3
2
1
128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM
A
B
C
D
E
F
G
H
J
0.8 TYP
Ball A1 ID
4 ±0.05
13
0.65 ±0.05
8 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID