MT47H64M8CF-25E IT:G Micron Technology Inc, MT47H64M8CF-25E IT:G Datasheet - Page 19

• Manufacturer Part Number: MT47H64M8CF-25E IT:G
• Description: 64MX8 DDR2 SDRAM PLASTIC IND TEMP FBGA 1.8V
• Manufacturer: Micron Technology Inc

Figure 9: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. T 2/12 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball
pads.
60X Ø0.45
Seating
0.12 A
Plane
8 CTR
0.8 TYP
Notes:
A
Nonconductive overmold
9 8 7
1. All dimensions are in millimeters.
2. Solder ball material for this package is also available as leaded eutectic (62% Sn, 36%
Pb, 2% Ag).
6.4 CTR
1.8 CTR
8 ±0.1
0.8 TYP
3 2 1
A
B
C
D
E
F
G
H
J
K
L
19
0.8 ±0.05
10 ±0.1
Ball A1 ID
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging