74LVC1G17GW-G NXP Semiconductors, 74LVC1G17GW-G Datasheet - Page 2

• Manufacturer Part Number: 74LVC1G17GW-G
• Description: Schmitt Trigger Buffer 1-CH Non-Inverting CMOS 5-Pin TSSOP
• Manufacturer: NXP Semiconductors

Specifications of 74LVC1G17GW-G

• Package: 5TSSOP
• Logic Family: LVC
• Logic Function: Schmitt Trigger Buffer
• Number Of Outputs Per Chip: 1
• Input Signal Type: Single-Ended
• Maximum Propagation Delay Time @ Maximum Cl: 3.2(Typ)@2.7V|3(Typ)@3.3V|2.2(Typ)@5V ns
• Tolerant I/os: 5 V
• Typical Quiescent Current: 0.1 uA
• Polarity: Non-Inverting

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC1G17
Product data sheet
Type number
74LVC1G17GW
74LVC1G17GV
74LVC1G17GM
74LVC1G17GF
74LVC1G17GN
74LVC1G17GS
Type number
74LVC1G17GW
74LVC1G17GV
74LVC1G17GM
74LVC1G17GF
74LVC1G17GN
74LVC1G17GS
Fig 1.
Fig 3.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Logic symbol
Logic diagram
Ordering information
Marking codes
2
A
Package
Temperature range
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
mnb150
Y
A
4
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 10 November 2010
Name
TSSOP5
SC-74A
XSON6
XSON6
XSON6
XSON6
Marking
VJ
V17
VJ
VJ
VJ
VJ
plastic extremely thin small outline package;
plastic extremely thin small outline package;
extremely thin small outline package; no leads;
extremely thin small outline package; no leads;
Description
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
plastic surface-mounted package; 5 leads
no leads; 6 terminals; body 1 × 1.45 × 0.5 mm
no leads; 6 terminals; body 1 × 1 × 0.5 mm
6 terminals; body 0.9 × 1.0 × 0.35 mm
6 terminals; body 1.0 × 1.0 × 0.35 mm
Fig 2.
[1]
IEC logic symbol
mnb152
Y
2
Single Schmitt trigger buffer
mnb151
74LVC1G17
4
© NXP B.V. 2010. All rights reserved.
Version
SOT353-1
SOT753
SOT886
SOT891
SOT1115
SOT1202
2 of 19