SHF-0289 Sirenza Microdevices Inc, SHF-0289 Datasheet - Page 4

IC HFET ALGAAS/GAAS 1W SOT-89

SHF-0289

Manufacturer Part Number
SHF-0289
Description
IC HFET ALGAAS/GAAS 1W SOT-89
Manufacturer
Sirenza Microdevices Inc
Datasheet

Specifications of SHF-0289

Transistor Type
HFET
Frequency
1.96GHz
Gain
20dB
Voltage - Rated
9V
Current Rating
400mA
Noise Figure
4dB
Current - Test
200mA
Voltage - Test
7V
Power - Output
30.2dBm
Package / Case
SOT-89
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
599-1061-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SHF-0289
Manufacturer:
SIRENZA
Quantity:
1 000
Part Number:
SHF-0289Z
Manufacturer:
RFMD
Quantity:
2 900
Part Number:
SHF-0289Z
Manufacturer:
SIRENZA
Quantity:
20 000
SHF-0289(Z)
Mounting and Thermal Considerations
It is very important that adequate heat sinking be provided to minimize the device junction temperature. The following items
should be implemented to maximize MTTF and RF performance.
1. Multiple solder-filled vias are required directly below the ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with multiple plated-through vias around pin 4 of the device. [CRITICAL]
3. Use two point board seating to lower the thermal resistance between the PCB and mounting plate. Place machine screws as
close to the ground tab (pin 4) as possible. [CRITICAL]
4. Use 2 ounce copper to improve the PCB’s heat spreading capability. [RECOMMENDED]
4 of 6
Pin
1
2
3
4
Recommended Mounting Configuration for Optimum RF and Thermal
Function
Source
Source
Drain
Gate
Description
RF input.
Connection to ground. Use via holes to reduce lead inductance. Place vias as close to ground leads as possible.
RF output.
Same as pin 2.
(0.020" DIA)
Plated Thru
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Machine
Screws
Holes
Performance
Ground Plane
SHF-0x89
EDS-101241 Rev F

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