BSH111,235 NXP Semiconductors, BSH111,235 Datasheet - Page 4

• Manufacturer Part Number: BSH111,235
• Description: MOSFET N-CH 55V 0.335A SOT23
• Manufacturer: NXP Semiconductors
• Series: TrenchMOS™r

Specifications of BSH111,235

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 4 Ohm @ 500mA, 4.5V
• Drain To Source Voltage (vdss): 55V
• Current - Continuous Drain (id) @ 25° C: 335mA
• Vgs(th) (max) @ Id: 1.3V @ 1mA
• Gate Charge (qg) @ Vgs: 1nC @ 8V
• Input Capacitance (ciss) @ Vds: 40pF @ 10V
• Power - Max: 830mW
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934056036235; BSH111 /T3; BSH111 /T3

Philips Semiconductors
7. Thermal characteristics
Table 4:
9397 750 09629
Product data
Symbol
R
R
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
th(j-sp)
th(j-a)
Z th(j-sp)
(K/W)
Mounted on metal clad substrate.
10 2
10 3
10
1
Thermal characteristics
10 -5
Parameter
thermal resistance from junction to
solder point
thermal resistance from junction to
ambient
= 0.5
0.02
0.05
0.1
0.2
single pulse
7.1 Transient thermal impedance
10 -4
10 -3
Rev. 02 — 26 April 2002
Conditions
mounted on metal clad
substrate;
minimum footprint; mounted on
printed circuit board
N-channel enhancement mode field-effect transistor
10 -2
Figure 4
10 -1
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Min
-
-
P
Typ
-
350
t p
1
T
BSH111
=
Max
150
-
t p
T
t
t p (s)
03aa69
10
Unit
K/W
K/W
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