WM8350GEB/V Wolfson Microelectronics, WM8350GEB/V Datasheet - Page 338

• Manufacturer Part Number: WM8350GEB/V
• Description: Audio CODECs Audio CODEC plus pwr management
• Manufacturer: Wolfson Microelectronics

Specifications of WM8350GEB/V

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

WM8350
30 PACKAGE DIAGRAM
w
2
B: 129 BALL BGA PLASTIC PACKAGE 7
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.
3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.
4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
8. FALLS WITHIN JEDEC, MO-195
SIDE VIEW
DETAIL 2
A2
A
Symbols
REF:
bbb
ddd
aaa
ccc
A1
A2
D1
E1
A
b
D
E
e
M
A
B
C
D
E
F
G
H
K
L
N
J
Tolerances of Form and Position
1
13
aaa
MIN
0.83
0.63
0.25
0.2
12
bbb
Z
Z
11
Z
10
JEDEC, MO-195
BOTTOM VIEW
A1
9
7.00 BSC
6.00 BSC
7.00 BSC
6.00 BSC
0.50 BSC
8
NOM
e
0.94
0.24
0.70
0.30
0.10
0.08
0.15
0.05
D1
7
6
5
Dimensions (mm)
4
DETAIL 2
3
X
MAX
2
7
1.05
0.28
0.77
0.35
DETAIL 1
X
1
0.94 mm BODY, 0.50 mm BALL PITCH
e
6
E1
NOTE
6
4
2 X
2 X
A1
CORNER
0.10
0.10
Z
Z
DETAIL 1
TOP VIEW
D
b
SOLDER BALL
5
3
ddd
ccc
PD, March 2010, Rev 4.2
Z
Z
X
Y
DM040.B
E
Production Data
338