ZXMC10A816N8TC Diodes Inc, ZXMC10A816N8TC Datasheet

MOSFET DUAL COMPL 100V 8-SOIC

ZXMC10A816N8TC

Manufacturer Part Number
ZXMC10A816N8TC
Description
MOSFET DUAL COMPL 100V 8-SOIC
Manufacturer
Diodes Inc
Datasheet

Specifications of ZXMC10A816N8TC

Fet Type
N and P-Channel
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
230 mOhm @ 1A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
2A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
9.2nC @ 10V
Input Capacitance (ciss) @ Vds
497pF @ 50V
Power - Max
1.8W
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ZXMC10A816N8DITR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ZXMC10A816N8TC
Manufacturer:
DIODES
Quantity:
15 000
Company:
Part Number:
ZXMC10A816N8TC
Quantity:
500
ZXMC10A816N8
100V SO8 Complementary Dual enhancement mode
MOSFET
Summary
Device
Description
This new generation complementary dual MOSFET
features low on-resistance achievable with low gate drive.
Features
Applications
Ordering information
Device
ZXMC10A816N8TC
Device marking
ZXMC
10A816
Issue 1.3 - March 2009
© Diodes Incorporated 2009
Q1
Q2
100 V Complementary in SOIC package
Low on-resistance
Fast switching speed
Low voltage (V
DC motor control
Backlighting
Class D Audio Output Stages (<100W)
V
(BR)DSS
-100
100
(V)
GS
= 4.5 V) gate drive
Q
Reel size
(inches)
G
16.5
9.2
(nC)
13
0.320 @ V
Tape width
0.300 @ V
0.235 @ V
0.230 @ V
(mm)
12
R
DS(on)
GS
GS
GS
GS
( )
= -4.5V
= 4.5V
= -10V
= 10V
1
Quantity
per reel
2,500
Diodes Incorporated
T
A Product Line of
A
I
= 25 C
D
-2.2
-1.9
2.1
1.9
(A)
G1
Q1 N-Channel
G2
G1
S2
S1
S1
D1
www.diodes.com
Top view
G2
Q2 P-Channel
D2
S2
D1
D1
D2
D2

Related parts for ZXMC10A816N8TC

ZXMC10A816N8TC Summary of contents

Page 1

... Fast switching speed Low voltage (V = 4.5 V) gate drive GS Applications DC motor control Backlighting Class D Audio Output Stages (<100W) Ordering information Device Reel size (inches) ZXMC10A816N8TC 13 Device marking ZXMC 10A816 Issue 1.3 - March 2009 © Diodes Incorporated 2009 A Product Line of Diodes Incorporated I (A) D ...

Page 2

... For a dual device with one active die. (e) For a device with two active die running at equal power. (f) Thermal resistance from junction to solder-point (at the end of the drain lead); the device is operating in a steady-state condition. Issue 1.3 - March 2009 © Diodes Incorporated 2009 (b)(d) = 10V (b)(d) = 10V ...

Page 3

... Pulse Width (s) Transient Thermal Impedance 100 10 1 100µ 1m 10m 100m Pulse Width (s) Pulse Power Dissipation Issue 1.3 - March 2009 © Diodes Incorporated 2009 10 R Limited 1 100m 10ms Note (a)(d) 1ms 10m 100us Single Pulse, T 0.1 10 100 P-channel Safe Operating Area 2 ...

Page 4

... Reverse recovery charge NOTES: (a) Measured under pulsed conditions. Pulse width (b) Switching characteristics are independent of operating junction temperature. (c) For design aid only, not subject to production testing Issue 1.3 - March 2009 © Diodes Incorporated 2009 = 25° C unless otherwise stated) amb Min. Typ. 100 ...

Page 5

... V Gate-Source Voltage (V) GS Typical Transfer Characteristics 0.1 0.01 0.1 I Drain Current (A) D On-Resistance v Drain Current Issue 1.3 - March 2009 © Diodes Incorporated 2009 10V 10 5V 4.5V 4V 3. 2.2 2.0 1.8 1.6 1.4 1 25° C 1.0 0.8 ...

Page 6

... Drain - Source Voltage (V) DS Capacitance v Drain-Source Voltage Test circuits Charge Basic gate charge waveform V DS 90% 10 d(on (on) Switching time waveforms Issue 1.3 - March 2009 © Diodes Incorporated 2009 1. 1MHz RSS 100 Charge (nC) Gate-Source Voltage v Gate Charge Gate charge test circuit t t d(off ...

Page 7

... Reverse recovery charge NOTES: (a) Measured under pulsed conditions. Pulse width (b) Switching characteristics are independent of operating junction temperature. (c) For design aid only, not subject to production testing Issue 1.3 - March 2009 © Diodes Incorporated 2009 = 25° C unless otherwise stated) amb Min. Typ. -100 ...

Page 8

... Output Characteristics T = 150° 3.0 3.5 4.0 -V Gate-Source Voltage (V) GS Typical Transfer Characteristics -V 3. 0.1 0 Drain Current (A) D On-Resistance v Drain Current Issue 1.3 - March 2009 © Diodes Incorporated 2009 10V T = 150° 4. 3.5V 0 0.01 10 2.0 1.8 1.6 1 25° C 1.2 1.0 0 10V 0 ...

Page 9

... Drain - Source Voltage (V) DS Capacitance v Drain-Source Voltage Test circuits Charge Basic gate charge waveform d(off) t (on) Switching time waveforms Issue 1.3 - March 2009 © Diodes Incorporated 2009 1MHz OSS 4 C RSS 100 0 Gate-Source Voltage v Gate Charge V DS 90% 10 ...

Page 10

... D 0.189 0.197 H 0.228 0.244 E 0.150 0.157 L 0.016 0.050 Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters Issue 1.3 - March 2009 © Diodes Incorporated 2009 Millimeters DIM Min. Max. 1.35 1.75 e 0.10 0.25 b 4.80 5.00 c 5.80 6.20 θ ...

Page 11

... Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. ...

Related keywords