SGP02N120 Infineon Technologies, SGP02N120 Datasheet

no-image

SGP02N120

Manufacturer Part Number
SGP02N120
Description
IGBT NPT 1200V 6.2A 62W TO220-3
Manufacturer
Infineon Technologies
Datasheet

Specifications of SGP02N120

Package / Case
TO-220-3 (Straight Leads)
Igbt Type
NPT
Voltage - Collector Emitter Breakdown (max)
1200V
Vce(on) (max) @ Vge, Ic
3.6V @ 15V, 2A
Current - Collector (ic) (max)
6.2A
Power - Max
62W
Input Type
Standard
Mounting Type
Through Hole
Configuration
Single
Collector- Emitter Voltage Vceo Max
1200 V
Maximum Gate Emitter Voltage
+/- 20 V
Maximum Operating Temperature
+ 150 C
Continuous Collector Current Ic Max
6.2 A
Minimum Operating Temperature
- 55 C
Mounting Style
Through Hole
Switching Frequency
Fast IGBT 10-40 kHz
Package
TO-220
Vce (max)
1,200.0 V
Ic(max) @ 25°
6.2 A
Ic(max) @ 100°
2.8 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
SGP02N120XK

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SGP02N120
Manufacturer:
Infineon Technologies
Quantity:
25 330
Fast IGBT in NPT-technology
Type
SGP02N120
SGD02N120
SGI02N120
Maximum Ratings
Parameter
Collector-emitter voltage
DC collector current
T
T
Pulsed collector current, t
Turn off safe operating area
V
Gate-emitter voltage
Avalanche energy, single pulse
I
Short circuit withstand time
V
Power dissipation
T
Operating junction and storage temperature
Soldering temperature,
PG-TO252 (reflow soldering, MSL3)
Other packages: 1.6mm (0.063 in.) from case for 10s
1
2
Power Semiconductors
C
C
C
C
CE
GE
J-STD-020 and JESD-022
Allowed number of short circuits: <1000; time between short circuits: >1s.
40% lower E
Short circuit withstand time – 10 s
Designed for:
NPT-Technology offers:
Qualified according to JEDEC
Pb-free lead plating; RoHS compliant
Complete product spectrum and PSpice Models :
= 2A, V
= 25 C
= 100 C
= 25 C
= 15V, 100V
1200V, T
- Motor controls
- Inverter
- SMPS
- very tight parameter distribution
- high ruggedness, temperature stable behaviour
- parallel switching capability
CC
= 50V, R
off
j
compared to previous generation
150 C
V
1200V
1200V
1200V
CC
GE
V
CE
= 25 , start at T
1200V, T
p
limited by T
2
1
2A
2A
2A
I
C
for target applications
j
150 C
jmax
0.11mJ
0.11mJ
0.11mJ
j
= 25 C
E
off
SGD02N120,
http://www.infineon.com/igbt/
150 C
150 C
150 C
T
1
j
PG-TO-252-3-11
(D-PAK)
GP02N120
GI02N120
Marking
02N120
Symbol
V
I
I
-
V
E
t
P
T
-
C
C p u l s
S C
j
C E
G E
A S
t o t
, T
s t g
PG-TO-220-3-1
PG-TO-252-3-11
PG-TO-262-3-1
PG-TO-220-3-1
G
Package
SGP02N120
-55...+150
SGI02N120
Value
1200
260
260
6.2
2.8
9.6
9.6
10
10
62
20
C
E
Rev. 2.3
PG-TO-262-3-1
(I²-PAK)
V
A
V
mJ
W
Unit
C
s
Sep. 07

Related parts for SGP02N120

SGP02N120 Summary of contents

Page 1

... E T Marking C off j 0.11mJ GP02N120 150 C 0.11mJ 02N120 150 C 0.11mJ GI02N120 150 C Symbol jmax 150 SGP02N120 SGI02N120 PG-TO-262-3-1 PG-TO-220-3-1 (I²-PAK) Package PG-TO-220-3-1 PG-TO-252-3-11 PG-TO-262-3-1 Value 1200 C E 6.2 2.8 9.6 9 -55...+150 260 260 Rev. 2.3 Unit ...

Page 2

... Allowed number of short circuits: <1000; time between short circuits: >1s. Power Semiconductors SGD02N120, Symbol Conditions PG-TO-220-3 PG-TO-262-3-1 R PG-TO-252-3- Symbol Conditions (one layer thick) copper area for 2 SGP02N120 SGI02N120 Max. Value Unit 2.0 K Value Unit min. typ. max. 1200 - - V 2.5 3.1 3.6 - 3.7 4 100 - - 100 nA 1 205 250 Rev. 2.3 Sep. 07 ...

Page 3

... reverse recovery. =150 C j Symbol Conditions Energy losses include t s “tail” and diode reverse recovery. 3 SGP02N120 SGI02N120 Value Unit min. typ. max 260 340 - 0.16 0. 0.06 0.08 - 0.22 0.29 Value Unit min. typ. max 290 350 - 85 ...

Page 4

... V Figure 2. Safe operating area ( 25°C 100°C 125°C Figure 4. Collector current as a function of case temperature ( SGP02N120 SGI02N120 150 s 500 s 20ms DC 10V 100V 1000V , - COLLECTOR EMITTER VOLTAGE 150 50°C 75°C 100°C 125° CASE TEMPERATURE ...

Page 5

... Power Semiconductors SGD02N120 Figure 6. Typical output characteristics (T = 150 11V -50°C T Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (V = 15V SGP02N120 SGI02N120 =17V GE 15V 13V 11V COLLECTOR EMITTER VOLTAGE =1A C 0°C 50°C 100°C 150°C , JUNCTION TEMPERATURE j Rev. 2.3 Sep ...

Page 6

... Figure 10. Typical switching times as a function of gate resistor (inductive load 800V dynamic test circuit in Fig. 100°C 150°C -50°C Figure 12. Gate-emitter threshold voltage as a function of junction temperature (I = 0.3mA SGP02N120 SGI02N120 t d(off d(on 100 150 R , GATE RESISTOR G = 150 +15V/0V 2A max. typ. min. ...

Page 7

... Fig K K/W E off -2 10 K/W 100°C 150°C 1µs Figure 16. IGBT transient thermal impedance as a function of pulse width ( SGP02N120 SGI02N120 *) E and E include losses on ts due to diode recovery. 50 100 150 R , GATE RESISTOR G = 150 +15V/0V 2A D=0.5 0.2 0 0.05 0.66735 ...

Page 8

... Figure 18. Typical capacitance as a function of collector-emitter voltage (V GE 40A 30A 20A 10A 0A 14V 15V 10V Figure 20. Typical short circuit collector current as a function of gate-emitter voltage (100V V 8 SGP02N120 SGI02N120 10V 20V 30V , - COLLECTOR EMITTER VOLTAGE 1MHz) 12V 14V 16V 18V V ...

Page 9

... Power Semiconductors SGD02N120, PG-TO220-3-1 9 SGP02N120 SGI02N120 Rev. 2.3 Sep. 07 ...

Page 10

... Power Semiconductors SGD02N120, PG-TO252-3-11 10 SGP02N120 SGI02N120 Rev. 2.3 Sep. 07 ...

Page 11

... Power Semiconductors SGD02N120, PG-TO262-3-1 (I² Pak) 10 ±0 0...0.3 1) 1.27 8.5 0.05 2.4 C 0...0.15 2.4 1. 0.75 ±0 2.54 0. Typical Metal surface min 7.25 6.9 All metal surfaces tin plated, except area of cut. 11 SGP02N120 SGI02N120 4.4 0.5 ±0.1 Rev. 2.3 Sep. 07 ...

Page 12

... Figure A. Definition of switching times Figure B. Definition of switching losses Power Semiconductors SGD02N120, i Figure C. Definition of diodes switching characteristics (t) j p(t) r Figure D. Thermal equivalent circuit Figure E. Dynamic test circuit Leakage inductance L =180nH, and stray capacity C =40pF. 12 SGP02N120 SGI02N120 Rev. 2.3 Sep. 07 ...

Page 13

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Power Semiconductors SGD02N120, 13 SGP02N120 SGI02N120 Rev. 2.3 Sep. 07 ...

Related keywords