SL3S1203FTB0,115 NXP Semiconductors, SL3S1203FTB0,115 Datasheet - Page 9

• Manufacturer Part Number: SL3S1203FTB0,115
• Description: IC UCODE G2XL SOT886
• Manufacturer: NXP Semiconductors
• Series: UCODE G2iLr

Specifications of SL3S1203FTB0,115

• Rf Type: Read / Write
• Frequency: 840MHz ~ 960MHz
• Features: 128 Bit EPC Memory
• Package / Case: 6-XFDFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
SL3S1203_1213_SDS
Product short data sheet
PUBLIC
10.1.2 Fail die identification
10.1.3 Map file distribution
Table 6.
[1]
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
See
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
Bump shear strength
Bump height
Bump height uniformity
within a die
– within a wafer
– wafer to wafer
Bump flatness
Bump size
– RFP, RFN
– OUT, VDD
Bump size variation
SL3S12x3FUF
SL3S12x3FUD
Because of the 7 μm sapcer, the bump will measure 18 μm relative height protruding the spacer.
Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
Specifications
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 31 January 2011
…continued
198733
> 70 MPa
18
25 μ
±
±
±
±
60
60
±
1.5
2
3
4
5
μ
×
×
μ
μ
μ
μ
m
m
m
m
m
m
μ
60
60
[1]
m
μ
μ
SL3S1203_1213
m
m
UCODE G2iL and G2iL+
© NXP B.V. 2011. All rights reserved.
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