SL3S1203FTB0,115 NXP Semiconductors, SL3S1203FTB0,115 Datasheet - Page 8

• Manufacturer Part Number: SL3S1203FTB0,115
• Description: IC UCODE G2XL SOT886
• Manufacturer: NXP Semiconductors
• Series: UCODE G2iLr

Specifications of SL3S1203FTB0,115

• Rf Type: Read / Write
• Frequency: 840MHz ~ 960MHz
• Features: 128 Bit EPC Memory
• Package / Case: 6-XFDFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
10. Mechanical specification
SL3S1203_1213_SDS
Product short data sheet
PUBLIC
10.1.1 Wafer
10.1 Wafer specification
The UCODE G2iL/G2iL+ wafers are available in 75 μm and 120 μm thickness. The 75 μm
thick wafer allows ultra thin label design and ease of clue dispenser adjustment during
production. Because of the more robust structure of the 120 μm wafer, the wafer is ideal
for harsh applications. The 120 μm thick wafer is also enhanced with 7μm Polyimide
spacer allowing additional protection of the active circuit.
See
UV-tape with electronic fail die marking, BU-ID document number:
Table 6.
Wafer
Designation
Diameter
Thickness
Number of pads
Pad location
Distance pad to pad RFN-RFP
Distance pad to pad OUT-RFN
Process
Batch size
Potential good dies per wafer
Wafer backside
Material
Treatment
Roughness
Chip dimensions
Die size including scribe
Scribe line width:
Passivation on front
Type
Material
Thickness
Polyimide spacer
Au bump
Bump material
Bump hardness
SL3S12x3FUF
SL3S12x3FUD
Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
Specifications
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 31 January 2011
198733
each wafer is scribed with batch number
and wafer number
200 mm (8”)
75
120
4
non diagonal/ placed in chip corners
333.0 µm
383.0 µm
CMOS 0.14 µm
25 wafers
130.000
Si
ground and stress release
R
0.485 mm
x-dimension = 15
y-dimension = 15
Sandwich structure
PE-Nitride (on top)
1.75
7 μ
> 99.9% pure Au
35 – 80 HV 0.005
a
m (SL3S12x3FUD only)
μ
max. 0.5
m
μ
μ
m
m total thickness of passivation
±
±
SL3S1203_1213
15
15
×
μ
μ
0.435 mm = 0.211 mm
m
μ
m, R
m
UCODE G2iL and G2iL+
μ
μ
t
m
m
1093**”.
max. 5
© NXP B.V. 2011. All rights reserved.
μ
m
2
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