SL3S1203FTB0,115 NXP Semiconductors, SL3S1203FTB0,115 Datasheet - Page 7

• Manufacturer Part Number: SL3S1203FTB0,115
• Description: IC UCODE G2XL SOT886
• Manufacturer: NXP Semiconductors
• Series: UCODE G2iLr

Specifications of SL3S1203FTB0,115

• Rf Type: Read / Write
• Frequency: 840MHz ~ 960MHz
• Features: 128 Bit EPC Memory
• Package / Case: 6-XFDFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
9. Wafer layout
SL3S1203_1213_SDS
Product short data sheet
PUBLIC
9.1 Wafer layout
Fig 4.
(1) X-scribe line width: 15 μm
(2) Y-scribe line width: 15 μm
(3) Chip step, x-length: 485 μm
(4) Chip step, y-length: 435 μm
(5) Bump to bump distance X (OUT - RFN): 383 μm
(6) Bump to bump distance Y (RFN - RFP): 333 μm
(7) Distance bump to metal sealring X: 40,3 μm (outer edge - top metal)
(8) Distance bump to metal sealring Y: 40,3 μm
Bump size X × Y: 60 μm × 60 μm
Remark: OUT and VDD are used with G2iL+ only
G2iL wafer layout
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 31 January 2011
(1)
(7)
(2)
198733
VDD
OUT
Y
(8)
not to scale!
(5)
(3)
X
RFN
RFP
SL3S1203_1213
(6)
UCODE G2iL and G2iL+
001aak871
(4)
© NXP B.V. 2011. All rights reserved.
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