SL3S1203FTB0,115 NXP Semiconductors, SL3S1203FTB0,115 Datasheet

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SL3S1203FTB0,115

Manufacturer Part Number
SL3S1203FTB0,115
Description
IC UCODE G2XL SOT886
Manufacturer
NXP Semiconductors
Series
UCODE G2iLr
Datasheet

Specifications of SL3S1203FTB0,115

Rf Type
Read / Write
Frequency
840MHz ~ 960MHz
Features
128 Bit EPC Memory
Package / Case
6-XFDFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
1. General description
2. Features and benefits
2.1.1 Memory
2.1 Key features
NXP’s UCODE G2iL series transponder ICs offer leading-edge read range and support
industry-first features such as a Tag Tamper Alarm, Data Transfer, Digital Switch, and
advanced privacy-protection modes.
Very high chip sensitivity (−18 dBm) enables longer read ranges with simple, single-port
antenna designs. When connected to a power supply, the READ as well as the WRITE
range can be boosted to a sensitivity of −27 dBm. In fashion and retail the UCODE G2iL
series improve read rates and provide for theft deterrence. For consumer electronics the
UCODE G2iL series is suited for device configuration, activation, production control, and
PCB tagging. In authentication applications the transponders can be used to protect
brands and guard against counterfeiting. They can also be used to tag containers,
electronic vehicles, airline baggage, and more.
In addition to the EPC specifications the G2iL offers an integrated Product Status Flag
(PSF) feature and read protection of the memory content.
On top of the G2iL features the G2iL+ offers an integrated tag tamper alarm, digital switch,
external supply mode, read range reduction and data transfer mode.
SL3S1203_1213
UCODE G2iL and G2iL+
Rev. 3.3 — 31 January 2011
198733
UHF RFID Gen2 tag chip according EPCglobal v1.2.0 with 128 bit EPC memory
Memory read protection
Integrated Product Status Flag (PSF)
Tag tamper alarm
Digital switch
Data transfer mode
Real Read Range Reduction (Privacy Mode)
External supply mode
128-bit of EPC memory
64-bit Tag IDentifier (TID) including 32-bit factory locked unique serial number
32-bit kill password to permanently disable the tag
32-bit access password to allow a transition into the secured state
Data retention: 20 years
Product short data sheet
PUBLIC

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SL3S1203FTB0,115 Summary of contents

Page 1

SL3S1203_1213 UCODE G2iL and G2iL+ Rev. 3.3 — 31 January 2011 198733 1. General description NXP’s UCODE G2iL series transponder ICs offer leading-edge read range and support industry-first features such as a Tag Tamper Alarm, Data Transfer, Digital Switch, and ...

Page 2

... NXP Semiconductors Broad international operating frequency: from 840 MHz to 960 MHz Long read/write ranges due to extremely low power design Reliable operation of multiple tags due to advanced anti-collision READ protection WRITE Lock Wide specified temperature range: −40 ° +85 °C 2.2 Key benefits 2.2.1 End user benefit ...

Page 3

... NXP Semiconductors 3. Applications 3.1 Markets Fashion (Apparel and footwear) Retail Electronics Fast Moving Consumer Goods Asset management Electronic Vehicle Identification 3.2 Applications Supply chain management Item level tagging Pallet and case tracking Container identification Product authentication PCB tagging Cost efficient, low level seals ...

Page 4

... NXP Semiconductors 5. Ordering information Table 2. Ordering information Type number Package Name SL3S1203FUF Wafer SL3S1213FUF Wafer [1] SL3S1203FUD/BG Wafer SL3S1213FUD/BG Wafer SL3S1203FTB0 XSON6 SL3S1213FTB0 XSON6 [1] Also available in 25 wafer shipping box. 6. Marking Table 3. Type number SL3S1203FTB0 SL3S1213FTB0 7. Block diagram The SL3S12x3 IC consists of three major blocks: ...

Page 5

... NXP Semiconductors ANTENNA VDD OUT Fig 1. SL3S1203_1213_SDS Product short data sheet PUBLIC ANALOG RF INTERFACE VREG PAD VDD RECT DEMOD data in MOD PAD data out PAD I/O PAD CONTROL Block diagram of G2iL IC All information provided in this document is subject to legal disclaimers. Rev. 3.3 — 31 January 2011 ...

Page 6

... NXP Semiconductors 8. Pinning information Fig 2. 8.1 Pin description Table 4. Symbol OUT RFN VDD RFP Table 5. Pin SL3S1203_1213_SDS Product short data sheet PUBLIC OUT RFN VDD NXP trademark RFP 001aam529 Pinning bare die Pin description bare die Description output pin grounded antenna connector ...

Page 7

... NXP Semiconductors 9. Wafer layout 9.1 Wafer layout Fig 4. SL3S1203_1213_SDS Product short data sheet PUBLIC (1) OUT Y (7) VDD (8) (2) (1) X-scribe line width: 15 μm (2) Y-scribe line width: 15 μm (3) Chip step, x-length: 485 μm (4) Chip step, y-length: 435 μm (5) Bump to bump distance X (OUT - RFN): 383 μm (6) Bump to bump distance Y (RFN - RFP): 333 μ ...

Page 8

... NXP Semiconductors 10. Mechanical specification The UCODE G2iL/G2iL+ wafers are available in 75 μm and 120 μm thickness. The 75 μm thick wafer allows ultra thin label design and ease of clue dispenser adjustment during production. Because of the more robust structure of the 120 μm wafer, the wafer is ideal for harsh applications. The 120 μ ...

Page 9

... NXP Semiconductors Table 6. Bump shear strength Bump height SL3S12x3FUF SL3S12x3FUD Bump height uniformity within a die – within a wafer – wafer to wafer Bump flatness Bump size – RFP, RFN – OUT, VDD Bump size variation Because of the 7 μm sapcer, the bump will measure 18 μm relative height protruding the spacer. ...

Page 10

... NXP Semiconductors 11. Functional description 11.1 Air interface standards The UCODE G2iL fully supports all parts of the "Specification for RFID Air Interface EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0". 11.2 Power transfer The interrogator provides an RF field that powers the tag, equipped with a UCODE G2iL ...

Page 11

... NXP Semiconductors 11.4 G2iL and G2iL+ differences The UCODE G2iL is tailored for application where mainly EPC or TID number space is needed. The G2iL+ in addition provides functionality such as tag tamper alarm, external supply operation to further boost read/write range (external supply mode), a Privacy mode reducing the read range or I/O functionality (data transfer to externally connected devices) required ...

Page 12

... NXP Semiconductors In addition to the three memory banks one configuration word to handle the G2iL specific features is available at EPC bank 01 address 200h. Memory pages (16 bit words) pre-programmed to zero will not execute an erase cycle before writing data to it. This approach accelerates initialization of the chip and enables faster programming of the memory ...

Page 13

... NXP Semiconductors 13. Characteristics 13.1 UCODE G2iL, G2iL+ bare die characteristics Table 10. G2iL, G2iL+ RF interface characteristics (RFN, RFP) Symbol Parameter f input frequency i Normal mode - no external supply, read range reduction OFF P minimum input power i(min) P minimum input power i(min) C input capacitance i Q quality factor ...

Page 14

... NXP Semiconductors Table 11. VDD pin characteristics Symbol Parameter Minimum supply voltage/current - without assisted EEPROM WRITE V input voltage DD I supply current DD Minimum supply voltage/current - assisted EEPROM READ and WRITE V input voltage DD I supply current DD Maximum supply voltage/current V input voltage DD I maximum input current ...

Page 15

... NXP Semiconductors For further reading we recommend application note “FAQ UCODE G2iL+“ describing the output characteristics more in detail. An example schematic is available in application note “UCODE G2iL+ Demoboard Manual“ available at NXP Document Control or at the website www.nxp.com. Table 13. Symbol EEPROM characteristics t ret ...

Page 16

... NXP Semiconductors 15. Abbreviations Table 15. Acronym CRC DC EAS EEPROM EPC FM0 G2 IC PSF RF UHF TID SL3S1203_1213_SDS Product short data sheet PUBLIC Abbreviations Description Cyclic Redundancy Check Direct Current Electronic Article Surveillance Electrically Erasable Programmable Read Only Memory Electronic Product Code (containing Header, Domain Manager, Object Class ...

Page 17

... NXP Semiconductors 16. References [1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0 (December 17, 2005) [2] EPCglobal: EPC Tag Data Standards [3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft) [4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference ...

Page 18

... NXP Semiconductors [19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15: Radio-frequency devices, U.S. Federal Communications Commission. [20] Data sheet - Delivery type description – General specification for 8” wafer on UV-tape with electronic fail die marking, BU-ID document number: 1093** [21] Data sheet - Flip chip strap - FCS2, General packing specification, BU-ID document ...

Page 19

... NXP Semiconductors 17. Revision history Table 16. Revision history Document ID Release date SL3S1203_1213_SDS v.3.3 20110131 • Modifications: • • SL3S1203_1213_SDS v.3.2 20101109 • Modifications: • SL3S1203_1213_SDS v.3.1 20101006 SL3S1203_1213_SDS Product short data sheet PUBLIC Data sheet status Product short data sheet Section 5 “Ordering information” ...

Page 20

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 21

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 22

... NXP Semiconductors 20. Tables Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .3 Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . . .4 Table 3. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .4 Table 4. Pin description bare die . . . . . . . . . . . . . . . . . . .6 Table 5. Pin description SOT886 . . . . . . . . . . . . . . . . . . .6 Table 6. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .8 Table 7. Overview of G2iL and G2iL+ features . . . . . . . 11 Table 8. G2iL memory sections . . . . . . . . . . . . . . . . . . . 11 [1][2] Table 9. Limiting values . . . . . . . . . . . . . . . . . . . . . .12 Table 10. G2iL, G2iL+ RF interface characteristics 21 ...

Page 23

... NXP Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1.1 Memory 2.2 Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2.1 End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2.2 Antenna design benefits . . . . . . . . . . . . . . . . . . 2 2.2.3 Label manufacturer benefit . . . . . . . . . . . . . . . . 2 2.3 Custom commands Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.1 Markets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3 5 Ordering information ...

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