DAC1205D650HW/C1:5 NXP Semiconductors, DAC1205D650HW/C1:5 Datasheet - Page 39

• Manufacturer Part Number: DAC1205D650HW/C1:5
• Description: DAC1205D650HW/HTQFP100/TRAYBDP
• Manufacturer: NXP Semiconductors

Specifications of DAC1205D650HW/C1:5

• Settling Time: 20ns
• Number Of Bits: 12
• Data Interface: SPI™
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 1.4W
• Operating Temperature: -45°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935286777551

NXP Semiconductors
12. Abbreviations
DAC1205D650
Product data sheet
Table 41.
Acronym
CDMA
CML
CMOS
DAC
FIR
GSM
IF
IMD3
LISB
LMDS
LSB
LTE
LVDS
MMDS
MSB
NCO
NMOS
PLL
SFDR
SPI
TD-SCDMA
UISB
WCDMA
WiMAX
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Code Division Multiple Access
Current Mode Logic
Complementary Metal-Oxide Semiconductor
Digital-to-Analog Converter
Finite Impulse Response
Global System for Mobile communications
Intermediate Frequency
Third-order Inter Modulation Distortion
Lower Intermediate Significant Byte
Local Multipoint Distribution Service
Least Significant Bit
Long Term Evolution
Low-Voltage Differential Signaling
Multichannel Multipoint Distribution Service
Most Significant Bit
Numerically Controlled Oscillator
Negative Metal-Oxide Semiconductor
Phase-Locked Loop
Spurious-Free Dynamic Range
Serial Peripheral Interface
Time Division-Synchronous Code Division Multiple Access
Upper Intermediate Significant Byte
Wideband Code Division Multiple Access
Worldwide Interoperability for Microwave Access
Rev. 2 — 13 September 2010
Dual 12-bit DAC, up to 650 Msps; 2× 4× and 8× interpolating
DAC1205D650
© NXP B.V. 2010. All rights reserved.
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