CY8C3665AXI-010 Cypress Semiconductor Corp, CY8C3665AXI-010 Datasheet - Page 86

• Manufacturer Part Number: CY8C3665AXI-010
• Description: PSOC3
• Manufacturer: Cypress Semiconductor Corp
• Series: PSOC™ 3 CY8C36xxr

Specifications of CY8C3665AXI-010

• Package / Case: *
• Voltage - Supply (vcc/vdd): 1.71 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 67MHz
• Number Of I /o: 62
• Eeprom Size: 1K x 8
• Core Processor: 8051
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Program Memory Size: 32KB (32K x 8)
• Data Converters: A/D 2x12b, D/A 4x8b
• Oscillator Type: Internal
• Peripherals: CapSense, DMA, POR, PWM, WDT
• Connectivity: EBI/EMI, I²C, LIN, SPI, UART/USART
• Core Size: 8-Bit
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Technology: CMOS
• Processing Unit: Microcontroller
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Package Type: TQFP
• Screening Level: Industrial
• Pin Count: 100
• Mounting: Surface Mount
• Rad Hardened: No
• Processor Series: CY8C36
• Core: 8051
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART, USB
• Maximum Clock Frequency: 67 MHz
• Number Of Programmable I/os: 28 to 72
• Number Of Timers: 4
• Operating Supply Voltage: 0.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Controller Family/series: (8051) PSOC 3
• No. Of I/o's: 62
• Eeprom Memory Size: 1KB
• Ram Memory Size: 4KB
• Cpu Speed: 67MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.5.5 Comparator
Table 11-25. Comparator DC Specifications
Table 11-26. Comparator AC Specifications
11.5.6 Current Digital-to-analog Converter (IDAC)
See the IDAC component data sheet in PSoC Creator for full electrical specifications and APIs.
Unless otherwise specified, all charts and graphs show typical values.
Table 11-27. IDAC DC Specifications
Document Number: 001-53413 Rev. *L
Notes
V
V
V
V
V
CMRR
I
T
I
Ezs
CMP
OUT
44. Based on device characterization (Not production tested).
45. The resistance of the analog global and analog mux bus is high if
46. The recommended procedure for using a custom trim value for the on-chip comparators can be found in the TRM.
RESP
ICM
OS
OS
OS
HYST
Parameter
Parameter
Parameter
mux bus under these conditions is not recommended.
Input offset voltage in fast mode
Input offset voltage in slow mode
Input offset voltage in fast mode
Input offset voltage in slow mode
Input offset voltage in ultra
low-power mode
Hysteresis
Input common mode voltage
Common mode rejection ratio
High current mode/fast mode
Low current mode/slow mode
Ultra low-power mode
Response time, high current
mode
Response time, low current
mode
Response time, ultra low-power
mode
Resolution
Output current at code = 255
Monotonicity
Zero scale error
[44]
[44]
[44]
Description
Description
Description
[44]
[44]
[44]
[45]
[45]
Factory trim, Vdda > 2.7 V,
Vin ≥ 0.5 V
Factory trim, Vin ≥ 0.5 V
Custom trim
Custom trim
Hysteresis enable mode
High current / fast mode
Low current / slow mode
Ultra low power mode
50 mV overdrive, measured
pin-to-pin
50 mV overdrive, measured
pin-to-pin
50 mV overdrive, measured
pin-to-pin
Range = 2.048 mA, code = 255,
V
Range = 2.048 mA, High mode,
code = 255, V
300 Ω
Range = 255 µA, code = 255, Rload
= 600 Ω
Range = 31.875 µA, code = 255,
Rload = 600 Ω
DDA
V
DDA ≤ 2.7 V, and the chip is in either sleep or hibernate mode. Use of analog global and analog
≥ 2.7 V, Rload = 600
Conditions
Conditions
Conditions
DDA
≤ 2.7 V, Rload =
Ω
PSoC
V
V
V
Min
Min
Min
SSA
SSA
SSA
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
®
31.875
2.048
2.048
Typ
±12
Typ
155
Typ
255
3: CY8C36 Family
10
50
75
55
–
–
–
–
–
–
–
6
–
–
0
V
V
DDA
DDA
Max
Max
V
110
200
Yes
Max
±1
400
100
–
8
–
–
–
–
Data Sheet
10
32
DDA
9
4
4
–
–
–
– 0.1
– 0.9
Page 86 of 126
Units
Units
Units
LSB
bits
mA
mA
µA
µA
mV
mV
mV
mV
mV
mV
ns
ns
µs
dB
µA
µA
µA
V
V
V