CY7C68034-56LTXC Cypress Semiconductor Corp, CY7C68034-56LTXC Datasheet - Page 36

• Manufacturer Part Number: CY7C68034-56LTXC
• Description: CY7C68034-56LTXC
• Manufacturer: Cypress Semiconductor Corp
• Series: CY7Cr

Specifications of CY7C68034-56LTXC

• Controller Type: USB 2.0 NAND Flash Controller
• Interface: USB
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 43mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-VQFN Exposed Pad, 56-HVQFN, 56-SQFN, 56-DHVQFN
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Processor Series: CY7C68xx
• Core: 8051
• Development Tools By Supplier: CY3684
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: CY3686 - DEV KIT USB 2.0 PER OLE
• Lead Free Status / Rohs Status: Compliant

Figure 22
needs to be designed to enable at least 50% solder coverage. The thickness of the solder paste template should be 5 mil. It is
recommended that ‘No Clean’ type 3 solder paste is used for mounting the part. Nitrogen purge is recommended during reflow.
Figure 23
Document Number: 001-04247 Rev. *H
is a plot of the solder mask pattern and
displays a cross-sectional area underneath the package. The cross section is of only one via. The solder paste template
Via hole for thermally connecting the
QFN to the circuit board ground plane.
Figure 22. Cross-section of the Area Underneath the QFN Package.
PCB Material
Figure 23. Plot of the Solder Mask (White Area)
Figure 24. X-ray Image of the Assembly
Figure 24
Cu Fill
displays an X-Ray image of the assembly (darker areas indicate solder).
Solder Mask
0.013” dia
0.017” dia
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and the Ground Plane.
Cu Fill
PCB Material
CY7C68033, CY7C68034
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