CY7C1480V33-167AXC Cypress Semiconductor Corp, CY7C1480V33-167AXC Datasheet - Page 30

• Manufacturer Part Number: CY7C1480V33-167AXC
• Description: CY7C1480V33-167AXC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1480V33-167AXC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 72M (2M x 36)
• Speed: 167MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Density: 72Mb
• Access Time (max): 3.4ns
• Sync/async: Synchronous
• Architecture: SDR
• Clock Freq (max): 167MHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 21b
• Package Type: TQFP
• Operating Temp Range: 0C to 70C
• Number Of Ports: 4
• Supply Current: 450mA
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 100
• Word Size: 36b
• Number Of Words: 2M
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-2169; CY7C1480V33-167AXC

Document Number: 38-05283 Rev. *J
Document History Page
Document Title: CY7C1480V33/CY7C1482V33/CY7C1486V33 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
Document Number: 38-05283
REV.
*C
*D
*A
*B
*E
*F
**
ECN NO.
114670
118281
233368
299452
323080
416193
470723
Submission
See ECN
See ECN
See ECN
See ECN
See ECN
08/06/02
01/21/03
Date
Orig. of
Change
HGK
PKS
NXR
VKN
NJY
SYT
PCI
New Data Sheet
Changed t
Updated features on page 1 for package offering
Removed 30-MHz offering
Updated Ordering Information
Changed Advanced Information to Preliminary
Changed timing diagrams
Changed logic block diagrams
Modified Functional Description
Modified “Functional Overview” section
Added boundary scan order for all packages
Included thermal numbers and capacitance values for all packages
Included IDD and ISB values
Removed 250-MHz speed grade offering and included 225-MHz speed bin
Changed package outline for 165FBGA package and 209-ball BGA
package
Removed 119-BGA package offering
Removed 225-MHz offering and included 250-MHz speed bin
Changed t
Changed Θ
100 TQFP Package on Page # 20
Added lead-free information for 100-Pin TQFP, 165 FBGA and 209 BGA
Packages
Added comment of ‘Lead-free BG packages availability’ below the
Ordering Information
Unshaded 200 and 167 MHz speed bin in the AC/DC Table and Selection
Guide
Address expansion pins/balls in the pinouts for all packages are modified
as per JEDEC standard
Added Address Expansion pins in the Pin Definitions Table
Added Truth Table and Note# 7 for CY7C1486V33 on page# 11
Added Industrial Operating Range
Modified V
Removed comment of ‘Lead-free BG packages availability’ below the
Ordering Information
Updated Ordering Information Table
Converted Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1
from “3901 North First Street” to “198 Champion Court”
Changed the description of I
Current on page# 19
Changed the I
to -30 μA and 5 μA
Changed the I
to -5 μA and 30 μA
Changed V
Replaced Package Name column with Package Diagram in the Ordering
Information table
Updated the Ordering Information Table
Added the Maximum Rating for Supply Voltage on V
Changed t
AC Switching Characteristics table
Updated the Ordering Information table
CO
CYC
TH
OL,
IH
JA
,t
from 2.4 to 2.6 ns for 250 MHz
X
< V
from 16.8 to 24.63 °C/W and Θ
V
TL
X
from 4.4 ns to 4.0 ns for 250-MHz Speed Bin
current values of MODE on page # 19 from -5 μA and 30 μA
OH
current values of ZZ on page # 19 from -30 μA and 5 μA
from 25 ns to 20 ns and t
DD
test conditions
to V
Description of Change
IH
< V
X
from Input Load Current to Input Leakage
DD
on page # 19
TDOV
JC
from 5 ns to 10 ns in TAP
from 3.3 to 2.28 °C/W for
CY7C1480V33
CY7C1482V33
CY7C1486V33
DDQ
Relative to GND
Page 30 of 31
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