ADSP-21369BSWZ-2A Analog Devices Inc, ADSP-21369BSWZ-2A Datasheet - Page 57

333 MHz, Shared Memory,S/PDIF EPAD PBfr

ADSP-21369BSWZ-2A

Manufacturer Part Number
ADSP-21369BSWZ-2A
Description
333 MHz, Shared Memory,S/PDIF EPAD PBfr
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr
Datasheet

Specifications of ADSP-21369BSWZ-2A

Interface
DAI, DPI
Clock Rate
333MHz
Non-volatile Memory
ROM (768 kB)
On-chip Ram
256kB
Voltage - I/o
3.30V
Voltage - Core
1.20V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
208-LQFP
Device Core Size
32/40Bit
Architecture
Super Harvard
Format
Floating Point
Clock Freq (max)
333MHz
Mips
333
Device Input Clock Speed
333MHz
Ram Size
256KB
Program Memory Size
768KB
Operating Supply Voltage (typ)
1.2/3.3V
Operating Supply Voltage (min)
1.14/3.13V
Operating Supply Voltage (max)
1.26/3.47V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
Package Type
LQFP EP
Package
208LQFP EP
Numeric And Arithmetic Format
Floating-Point
Maximum Speed
333 MHz
Device Million Instructions Per Second
333 MIPS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21369BSWZ-2A
Manufacturer:
Analog Devices Inc
Quantity:
10 000
SURFACE-MOUNT DESIGN
Table 47
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 47. BGA_ED Data for Use with Surface-Mount Design
Package
256-Lead Ball Grid Array BGA_ED
(BP-256)
is provided as an aide to PCB design. For industry-
BALL A1
INDICATOR
TOP VIEW
BSC SQ
27.00
Figure 51. 256-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
Ball Attach Type
Solder Mask Defined (SMD)
DETAIL A
0.10 MIN
1.70 MAX
COMPLIANT TO JEDEC STANDARDS MO-192-BAL-2
0.25 MIN
(4 )
Rev. E | Page 57 of 60 | July 2009
Dimension shown in millimeters
BSC SQ
24.13
(BP-256)
BSC
1.27
0.90
0.75
0.60
DETAIL A
BALL DIAMETER
20
ADSP-21367/ADSP-21368/ADSP-21369
19
18
17
16
Solder Mask Opening
0.63 mm
15
14
13
BOTTOM
12
VIEW
11
10
SEATING
PLANE
9
8
1.00
0.80
0.60
A1 CORNER
INDEX AREA
7
6
5
4
3
COPLANARITY
0.20
2
1
B
C
D
E
F
G
H
K
L
M
N
P
R
U
A
J
T
V
W
Y
0.70
0.60
0.50
Ball Pad Size
0.73 mm

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